Integrated MEMS Switch and Filter Packaging for Reduced Insertion Loss
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Solution Overview
Problem
Existing MEMS switches and filters are packaged separately, leading to complex processes, high costs, large occupied area, and high signal insertion loss due to long connection lines.
Innovation Solution
An electronic device integrating a MEMS switch and a filter on a single substrate, with conductive pillars and vias for electrical coupling, and a package cover plate for protection, reducing size and cost while improving integration and signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If MEMS switches and filters are packaged separately, then each component can be optimized independently, but the overall device size increases and signal insertion loss increases due to long connection lines
Solution Approach 1:
The patent combines the MEMS switch and filter into a single integrated package on one substrate. The switch and filter share common electrodes and are connected through short internal pathways rather than long external connection lines, thereby reducing device size while improving signal integrity by minimizing insertion loss.
2Ease of manufacture
If MEMS switches and filters are packaged separately, then manufacturing processes are simpler for each component, but the overall fabrication process becomes more complex and costs increase
Solution Approach 1:
The patent integrates both the MEMS switch and filter fabrication processes into a single unified manufacturing flow. The device is fabricated as one complete unit on a single substrate using coordinated processing steps, eliminating the need for separate packaging operations and reducing overall process complexity despite the advanced integration requirements.
3Reliability
If MEMS switches and filters are packaged separately, then each component can be tested independently, but the overall production cost increases
Solution Approach 1:
The patent enables testing of the integrated device as a complete functional unit, allowing verification of the switch-filter interaction and overall system performance. This integrated testing approach, combined with the single-package manufacturing, reduces per-unit production costs compared to separate packaging and assembly operations.
Data Source
AI summary
An electronic device includes a substrate having a first surface and a second surface opposite to each other in a thickness direction of the substrate, wherein the substrate has first and second connection vias which penetrate through the substrate in the thickness direction of the substrate, and first and second conductive pillars are respectively in the first connection via and the second connection via; a switch on the first surface of the substrate and comprising first and second signal electrodes, wherein the first signal electrode is electrically coupled to a first terminal of the first conductive pillar, and the second signal electrode is electrically coupled to a first terminal of the second conductive pillar; and a filter on the second surface of the substrate.