MEMS Switch Fabrication Using Laser Milling and PCB Etching
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The high cost and complexity of manufacturing miniature RF filters due to the requirement for state-of-the-art processing technologies and silicon micro-fabrication equipment, such as deep reactive ion etching (DRIE) or standard reactive ion etching (RIE), make it challenging to develop low-cost, easily fabricated micro electro-mechanical system (MEMS) switch devices.
Innovation Solution
A method involving the formation of base circuit layers by etching conductive metal layers on substrate layers, followed by laser milling of dielectric film layers to create spacer and switch structures, and assembling these layers with thermal compression to form a MEMS switch system, which can be used in RF filters and other applications without the need for silicon micro-fabrication equipment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If state-of-the-art processing technologies and silicon micro-fabrication equipment are used, then manufacturing precision is improved, but manufacturing cost and device complexity increase
Solution Approach 1:
The patent replaces complex silicon micro-fabrication equipment with conventional PCB manufacturing equipment. Specifically, it substitutes deep reactive ion etching (DRIE) and standard reactive ion etching (RIE) processes with laser drilling and chemical etching methods that are standard in PCB industry, thereby reducing device complexity while maintaining manufacturing precision
Solution Approach 2:
The patent changes the manufacturing parameters from semiconductor-grade precision requirements to PCB-grade parameters. By adjusting etching depths, laser drilling specifications, and material properties to match conventional PCB capabilities, the invention achieves acceptable manufacturing precision without requiring expensive state-of-the-art equipment
2Manufacturing precision
If state-of-the-art processing technologies are used, then manufacturing precision is improved, but manufacturing cost increases
Solution Approach 1:
The patent substitutes expensive silicon micro-fabrication equipment with conventional PCB manufacturing equipment. By using laser drilling and chemical etching instead of DRIE and RIE processes, the invention dramatically reduces manufacturing cost while maintaining sufficient precision for MEMS switch fabrication
Solution Approach 2:
The patent employs disposable or easily replaceable PCB manufacturing tools and materials instead of expensive, specialized semiconductor fabrication equipment. This approach uses off-the-shelf PCB drilling and etching capabilities that are widely available and cost-effective
3Ease of manufacture
If conventional PCB manufacturing methods are used, then ease of manufacture is improved, but manufacturing precision deteriorates
Solution Approach 1:
The patent applies local quality enhancement by focusing conventional PCB manufacturing processes on specific critical areas. Laser drilling and chemical etching are precisely controlled in regions where MEMS switch features require high precision, while other areas use standard PCB tolerances, thereby achieving adequate overall precision with ease of manufacture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the cost-effective and efficient fabrication of MEMS switch systems, enabling quick design cycles and low-cost RF solutions, such as miniature filters, without relying on expensive silicon-based micro-fabrication techniques.
Implementation Method 1
laser milling of a dielectric film layer is performed to create a spacer layer. Further laser milling is performed with respect to the flexible dielectric film layer to form at least one switch structure
Implementation Method 2
When the stack is completed, heat and pressure are applied to join the various layers forming the stack
Data Source
AI summary
A method for manufacturing a micro electro-mechanical system (MEMS) switch system (600, 700) includes etching each of a plurality of base circuit layers (425) and a plurality of passive component substrate layers (412, 418, 42, 426). The method continues with laser milling of a first dielectric film (406) to create a spacer layer (405). A metal cladding (402, 403) formed on a flexible dielectric film layer 404 is etched so as to form a plurality of switch component features. Further laser milling is performed with respect to the flexible dielectric film layer to form at least one switch structure (448, 450). Thereafter, a stack (400) is assembled which is comprised of the spacer layer disposed between the flexible dielectric film layer and the plurality of base circuit layers. Additional layers can also be included in the stack. When the stack is completed, heat and pressure are applied to join the various layers forming the stack.