MEMS Switched Piezoelectric Array for Element-Level Addressing
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Solution Overview
Problem
Addressing the technical challenge of efficiently controlling and addressing individual piezoelectric transducer elements in 2D arrays is complex due to the rapid scaling of channels, requiring intricate device interconnection and multi-layered flex assemblies, which increases complexity and overhead in applications like ultrasonic imaging and printing.
Innovation Solution
Integration of MicroElectroMechanical Systems (MEMS) switches with transducer elements within the array, allowing for element-level addressing and reducing interconnects by employing MEMS switches to couple drive/sense circuits directly to specific transducer elements, thereby simplifying the connection to CMOS control circuitry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If individual addressing of transducer elements in 2D arrays is implemented, then functionality and imaging capability are enhanced, but device complexity and interconnection requirements increase rapidly
Solution Approach 1:
The patent segments the control architecture by integrating MEMS switches directly with each transducer element, dividing the complex interconnection task into manageable element-level units. Each transducer element is paired with its own MEMS switch, creating modular units that can be independently controlled without requiring complex external routing.
Solution Approach 2:
The patent transitions from planar 2D array indexing to 3D spatial addressing by utilizing the vertical dimension for signal routing. Multiple transducer elements are connected through vertical vias and interlayer conductors, allowing signals to access elements from above rather than requiring lateral routing across the substrate.
2Quantity of substance
If the number of channels is increased to address more transducer elements, then array coverage and functionality improve, but bandwidth requirements and overhead increase
Solution Approach 1:
The patent merges the switch control functionality with the transducer element drive/sense circuits by integrating both functions into the same substrate layer. This consolidation reduces the number of separate control channels needed, as the MEMS switches are controlled through the existing element addressing infrastructure rather than requiring dedicated control lines.
Solution Approach 2:
The patent implements multi-functional transducer elements that can operate in both transmit and receive modes through the same physical pathway. The integrated MEMS switch serves dual purposes: controlling the transmit signal to the piezoelectric element and routing the received echo signal back to the readout circuitry, eliminating the need for separate control channels for each direction.
3Ease of operation
If multi-layered flex assemblies are used for interconnection, then routing flexibility is improved, but manufacturing complexity and overhead increase
Solution Approach 1:
The patent creates a simplified interconnection model by routing all signals through vertical vias from the top surface, replicating a standardized access pattern for each transducer element. This uniform via-based approach replaces complex multi-layer flex routing with a consistent, easily manufacturable via structure that can be created using standard semiconductor fabrication processes.
Solution Approach 2:
The patent replaces mechanical flex assembly routing with a monolithic integrated circuit structure. Instead of using flexible printed circuit boards and mechanical connectors, the interconnections are formed directly in the substrate using deposited conductive layers and etched vias, eliminating the need for separate mechanical assembly steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the complexity of interconnects and bandwidth requirements, enabling more efficient control and addressing of transducer elements within 2D arrays, facilitating advanced functionalities such as 3D imaging and enhanced printing capabilities.
Implementation Method 1
a piezoelectric transducer element includes a piezoelectric membrane capable of mechanical deflection of the membrane in response to a time-varying driving voltage
Implementation Method 2
The same piezoelectric membrane can also receive reflected pressure waves from the propagation media and convert the received pressure waves into electrical signals
Implementation Method 3
In certain embodiments, a MEMS switch employs the same piezoelectric material employed in the transducer
Data Source
AI summary
Switchable micromachined transducer arrays are described where a MicroElectroMechanical Systems (MEMS) switch, or relay, is monolithically integrated with a transducer element. In embodiments, the MEMS switch is implemented in the same substrate as the transducer array to implement one or more logic, addressing, or transducer control function. In embodiments, each transducer element of an array is a piezoelectric element coupled to at least one MEMS switch to provide element-level addressing within the array. In certain embodiments the same piezoelectric material employed in the transducer is utilized in the MEMS switch.