MEMS Thermopile Sensor Package Orthogonal Lead Design
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Solution Overview
Problem
Existing sensor modules for measuring core body temperature suffer from poor responsiveness due to high heat resistance and heat capacity, leading to inaccurate measurements, and MEMS chips used for temperature difference measurement are susceptible to ambient temperature fluctuations.
Innovation Solution
A sensor package design that includes a MEMS chip with thermopiles disposed in a bottomed tubular casing, where the measurement direction of the thermopiles is orthogonal to the longitudinal direction of the leads, minimizing the impact of inflowing heat and enhancing measurement accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If conventional sensor modules with high heat resistance and heat capacity heat insulators are used, then measurement stability is improved, but responsiveness deteriorates
Solution Approach 1:
The patent changes the thermal parameters of the heat insulator by using a MEMS chip with a thermopile structure that has significantly lower heat resistance and heat capacity compared to conventional heat insulators. This parameter change enables the sensor to respond quickly to temperature changes while maintaining measurement accuracy through the thermopile's inherent temperature sensing capability.
2Speed
If MEMS chip with thermopile is used, then responsiveness is improved, but measurement precision deteriorates due to ambient temperature sensitivity
Solution Approach 1:
The patent measures temperature difference in a specific direction (vertical direction through the thermopile) rather than relying on conventional two-sided temperature sensing. By measuring the temperature gradient in the thickness direction of the MEMS chip, the system achieves both rapid response and accurate measurement by capturing the actual heat flow direction from the body surface.
Solution Approach 2:
The patent replaces the mechanical/conventional heat insulator structure with a MEMS-based thermopile system that uses semiconductor technology. This substitution enables miniaturization and integration of the heat insulator function directly into the sensing element, achieving both fast response and precise measurement capability.
3Ease of operation
If leads are provided in the package, then electrical connection is improved, but heat inflow increases causing measurement error
Solution Approach 1:
The patent applies different thermal properties to different parts of the package structure. The leads are designed with specific thermal characteristics that minimize heat inflow to the thermopile measurement region, while maintaining electrical connectivity. The package structure creates localized thermal zones that protect the measurement accuracy despite the presence of leads.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for accurate measurement of internal temperatures and detection of infrared radiation, reducing measurement errors and improving responsiveness in temperature measurement applications.
Implementation Method 1
a MEMS chip including one thermopile that measures a temperature difference in a predetermined direction or plural thermopiles each of which measures a temperature difference in an identical direction
Implementation Method 2
The package includes a heat transfer portion for improved conductivity and a non-heat transfer portion to reduce errors
Data Source
AI summary
Provided is a sensor package that measures an internal temperature of a measurement object. A sensor package includes: a package including a bottomed tubular casing and plural leads substantially parallel to each other, each of the leads piercing the bottomed tubular casing; and a MEMS chip including at least one thermopile that measures a temperature difference in an identical direction. The MEMS chip is disposed in an inner bottom surface of the bottomed tubular casing of the package in a posture in which a measurement direction of the temperature difference measured with the thermopile is substantially orthogonal to a longitudinal direction of each lead.