MEMS Sound Wave Transducer Vertical Stacking
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Solution Overview
Problem
Existing speaker structures and manufacturing technologies are inadequate for integration into multimedia player devices that require miniaturization, portability, and lightness, as they fail to efficiently accommodate sound wave transducers while maintaining performance.
Innovation Solution
A sound wave transducer module is developed, comprising a first board with a carrier, substrate, and metal layers, along with a spacer layer and a second board, which includes a capacitive or piezoelectric-based MEMS microphone design that integrates a signal processing unit and sealant to enhance performance and compactness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If existing speaker structures are used, then sound output function is achieved, but device size and weight increase
Solution Approach 1:
The patent replaces traditional electromagnetic speaker mechanisms with a MEMS-based capacitive or piezoelectric microspeaker. The microspeaker uses a capacitive plate or piezoelectric element to generate sound waves, eliminating the need for heavy electromagnetic coils and magnets. This substitution dramatically reduces device weight while maintaining sound output functionality through electrostatic or piezoelectric actuation of the diaphragm.
Solution Approach 2:
The patent transitions from traditional planar speaker designs to a three-dimensional stacked configuration where the MEMS microspeaker is integrated vertically between substrate and cover layers. The spacer layer creates vertical spacing to form the capacitive gap, enabling the speaker to operate in the vertical dimension rather than requiring horizontal space. This dimensional change allows compact integration into thin portable devices.
2Length of stationary object
If traditional speaker structures are used, then sound output is achieved, but device thickness increases
Solution Approach 1:
The patent integrates the MEMS microspeaker structure within a nested multi-layer configuration. The speaker components (substrate, spacer layer, capacitive plate/piezoelectric element, diaphragm, and cover layer) are stacked vertically like nested dolls, with each layer contained within the overall device envelope. This nesting approach minimizes the horizontal footprint and reduces device thickness while maintaining all necessary speaker functions.
Solution Approach 2:
The patent employs thin-film technologies throughout the microspeaker structure. The diaphragm is formed as a thin flexible membrane that can vibrate to produce sound. The spacer layer and various functional layers are deposited as thin films, enabling the entire speaker assembly to achieve minimal thickness. The thin-film construction allows the speaker to fit within ultra-thin portable device form factors.
3Volume of moving object
If MEMS microspeaker is integrated, then device miniaturization is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent divides the microspeaker manufacturing process into distinct segmented stages: substrate preparation, spacer layer formation, capacitive plate or piezoelectric element deposition, diaphragm formation, and cover layer attachment. Each stage can be processed independently using standard semiconductor fabrication techniques. This segmentation of the manufacturing process reduces overall complexity by breaking down the integrated device into manageable fabrication steps that can be performed sequentially.
4Weight of moving object
If miniaturized transducer is used, then portability is improved, but sound detection capability may deteriorate
Solution Approach 1:
The patent optimizes key parameters of the MEMS microspeaker to maintain sound detection capability despite miniaturization. The diaphragm is designed with specific thickness, material composition, and geometric dimensions that maximize its sensitivity to sound pressure variations. The capacitive gap distance and electrode area are carefully controlled to enhance the transducer's response to acoustic signals. These parameter optimizations ensure that the miniaturized device maintains adequate sound detection performance for portable applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides significant performance advantages by reducing the dimension of the sound wave transducers while increasing yield, enabling effective integration into portable devices with improved sound detection capabilities.
Implementation Method 1
a capacitive or piezoelectric-based MEMS microphone design
Implementation Method 2
a capacitive or piezoelectric-based MEMS microphone design
Data Source
AI summary
A sound wave transducer is provided. The sound wave transducer includes a first board, a spacer layer and a second board over the first board and the spacer layer. The first board includes a carrier, a first substrate layer and a first metal layer. The carrier has a first opening formed in a central region. The first substrate layer is disposed on the carrier and over the first opening. The first metal layer is disposed on the first substrate layer. The spacer layer is disposed on the first board and surrounds the central region. The second board includes a second substrate layer, a second metal layer disposed on the spacer layer, and a plurality of second openings penetrating through the second substrate layer and the second metal layer.