MEMS Sensing Device Wafer-Level Packaging Integration
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Solution Overview
Problem
Traditional MEMS devices require complex and costly packaging processes, such as QFN or LGA, which are not compatible with typical CMOS semiconductor processes, leading to high manufacturing costs.
Innovation Solution
A MEMS sensing device is developed with a wafer-level packaging process integrated after a CMOS process, featuring a substrate with a MEMS device region, a sealing film, an adhesive layer, and leads that extend to the substrate's second surface, allowing external pressure measurement through openings in the cover or adhesive layer, and utilizing TSVs or T contacts for electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional QFN or LGA packaging processes are used for MEMS devices, then the devices can be assembled and combined in products, but the manufacturing process becomes complicated and costs increase
Solution Approach 1:
The patent merges the packaging process with the CMOS manufacturing process by integrating wafer-level packaging steps directly into the semiconductor fabrication line. This eliminates the need for separate, complex post-fabrication packaging operations while maintaining device assembly capability through direct integration of functional elements into the wafer structure
2Reliability
If traditional QFN or LGA packaging processes are used for MEMS devices, then the devices can be assembled and combined in products, but manufacturing costs increase
Solution Approach 1:
The patent combines packaging operations with CMOS fabrication processes, allowing both to be performed in the same manufacturing line using standard semiconductor equipment. This integration eliminates the need for specialized packaging facilities and reduces overall manufacturing costs while maintaining device assembly capability
Solution Approach 2:
The patent creates a multi-functional wafer structure that serves both as the device substrate and as the packaging housing. This universal structure performs multiple functions (device support, sealing, electrical connection, mechanical protection) that traditionally required separate components, thereby reducing material costs and simplifying manufacturing
3Ease of manufacture
If wafer level packaging process is integrated after CMOS process, then manufacturing process is simplified and costs are reduced, but packaging functionality must be maintained
Solution Approach 1:
The patent integrates packaging functionality directly into the wafer structure through combined CMOS and packaging processes. The wafer itself becomes the packaging housing, eliminating the need for separate packaging steps while maintaining all necessary packaging functions including sealing, electrical connection, and mechanical protection
4Reliability
If multiple materials not commonly used in CMOS process are used, then packaging functionality is achieved, but manufacturing cost increases
Solution Approach 1:
The patent uses standard CMOS materials (silicon, silicon dioxide, silicon nitride, metal interconnect layers) to perform multiple functions including device fabrication, sealing, electrical connection, and structural support. This eliminates the need for specialized packaging materials while maintaining full packaging functionality through the multi-functional wafer structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process and reduces costs by integrating packaging within the CMOS process, enabling high-throughput production of MEMS devices while maintaining functionality.
Implementation Method 1
a cover mounted on the MEMS device region and adhered by the adhesive layer
Implementation Method 2
a film overlaid on the MEMS device region to seal the chamber as a sealed space
Implementation Method 3
the MEMS device region includes a variable capacitor whose capacitance is changeable according to air pressure acting on the film
Implementation Method 4
the opening allows external air outside the MEMS sensing device to pressure the film
Data Source
AI summary
The present invention discloses a MEMS sensing device which comprises a substrate, a MEMS device region, a film, an adhesive layer, a cover, at least one opening, and a plurality of leads. The substrate has a first surface and a second surface opposite the first surface. The MEMS device region is on the first surface, and includes a chamber. The film is overlaid on the MEMS device region to seal the chamber as a sealed space. The cover is mounted on the MEMS device region and adhered by the adhesive layer. The opening is on the cover or the adhesive layer, allowing the pressure of the air outside the device to pressure the film. The leads are electrically connected to the MEMS device region, and extend to the second surface.