Waterproof MEMS Package via Substrate Through-Hole Membrane
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Solution Overview
Problem
Current MEMS chip packaging methods, which rely on protective colloids to prevent moisture and dust interference, complicate the packaging process and are not entirely effective in ensuring the longevity of the packaged components.
Innovation Solution
A waterproof MEMS chip package structure featuring a substrate with a through hole, a polymer-based waterproof membrane, an analog chip, a MEMS chip, and a top cover, where the membrane is clamped between substrate layers to prevent moisture entry through the hole, simplifying the packaging process and enhancing protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a layer of protective colloid is used to coat the chips, then the chips can resist moisture and dust interference, but the packaging process becomes more complicated
Solution Approach 1:
The patent combines the waterproof membrane function with the substrate structure by integrating the membrane into the through-hole of the substrate. This merging eliminates the need for separate protective colloid coating steps while maintaining waterproof protection for the chips, thus resolving the contradiction between reliability and process complexity
Solution Approach 2:
The waterproof membrane acts as an intermediary element that provides the waterproof barrier function. By placing the membrane within the substrate's through-hole, it serves as a mediator between the external environment and the chips, providing protection without requiring complex external coating processes
2Object-affected harmful factors
If protective colloid is applied to the chips, then moisture interference is prevented, but the service life is not sufficiently extended
Solution Approach 1:
The patent employs a waterproof membrane as a thin film structure that provides superior moisture barrier protection compared to protective colloids. This thin film integration into the substrate creates a more robust sealing mechanism that effectively prevents moisture ingress, thereby extending the service life of the packaged chips
Solution Approach 2:
The substrate structure is designed as a composite incorporating the waterproof membrane material within its through-hole. This composite construction provides enhanced durability and moisture resistance compared to simple protective colloid coatings, contributing to extended service life of the packaged components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents moisture and dust from entering the package, thereby extending the service life of the MEMS chip package by using a polymer-based waterproof membrane integrated into the substrate structure.
Implementation Method 1
The waterproof membrane is disposed in the through hole of the substrate... effectively prevent external moisture from entering the accommodation chamber through the through hole
Data Source
AI summary
A waterproof MEMS chip package structure includes a substrate having aa through hole cut through opposing top and bottom surface thereof, a waterproof membrane disposed in the through hole, an along chip bonded to the top surface of the substrate, a MEMS chip stacked on the analog chip and electrically connected to the substrate and the analog chip by wire bonding, and a top cover mounted on the substrate to form an accommodation chamber that accommodates the analog chip and the MEMS chip and communicates with the outside through the through hole. Therefore, the MEMS chip package structure of the present invention utilizes the waterproof membrane to block water vapor from entering the accommodation chamber through the through hole, thereby achieving the effect of protecting the chips.