MEMS Assembly Wiring Bridge for Parasitic Capacitance Reduction
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Solution Overview
Problem
High-impedance electrical paths in high-performance MEMS microphones are hindered by undesired parasitic capacitances, reducing sensitivity and overall performance.
Innovation Solution
A MEMS assembly with a support component configured as a wiring bridge between the MEMS component and the integrated circuit arrangement, using bond wires or metal pins for electrical connection, and arranged in a mirror-inverted fashion to minimize parasitic capacitances with respect to ground.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrical connection lines are arranged directly between MEMS component and integrated circuit arrangement, then electrical connection is achieved, but parasitic capacitances increase reducing sensitivity
Solution Approach 1:
A support component is introduced as an intermediary element between the MEMS component and the integrated circuit arrangement. This support component carries electrical connection lines that are mirror-inverted with respect to the MEMS component, thereby reducing parasitic capacitances while maintaining necessary electrical connections. The support component acts as a mediator that resolves the conflict between achieving electrical connection and minimizing harmful parasitic effects.
2Object-affected harmful factors
If mirror-inverted contact pads are arranged on support component, then parasitic capacitances are reduced, but manufacturing complexity increases
Solution Approach 1:
The support component is prepared in advance with contact pads arranged in a mirror-inverted configuration relative to the MEMS component. This preliminary arrangement of the contact pads on the support component before final assembly facilitates the reduction of parasitic capacitances. The mirror-inverted pattern is pre-established on the support component, which then guides the subsequent bonding process to achieve proper alignment and minimize harmful capacitances.
Data Source
AI summary
A MEMS assembly includes a package, wherein the package includes a substrate and a cover element, wherein a through opening is provided in the cover element, a MEMS component within the package on the cover element, an integrated circuit arrangement within the package on the substrate, and a support component within the package on the substrate, wherein the support component on the substrate is electrically coupled, by first electrical connection lines, to the MEMS component on the cover element and is electrically coupled, by second electrical connection lines, to the circuit arrangement on the substrate in order to produce an electrical connection between the MEMS component and the integrated circuit arrangement.