3D Non-Volatile Memory Merge Driver for Charge Leakage Reduction
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Solution Overview
Problem
Semiconductor memory devices face challenges in reducing boosting charge leakage, which affects the efficiency and reliability of operations in flash memory systems.
Innovation Solution
A three-dimensional (3D) non-volatile memory device is designed with a merge driver that applies a merge voltage at the same level to a common source line and a bulk in the memory cell array during read, program, and erase operations, eliminating the need for separate bulk and common source line drivers, thereby reducing charge leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate bulk and common source line drivers are used, then better control of voltage levels can be achieved, but device complexity increases
Solution Approach 1:
The patent combines the bulk driver and common source line driver into a single merged driver that applies the same voltage level to both the bulk and common source line simultaneously. This merging eliminates the need for separate driver circuits while maintaining proper voltage control, thereby reducing device complexity without sacrificing voltage control reliability.
2Device complexity
If a merged driver is used to reduce device complexity, then charge leakage increases due to unoptimized voltage control
Solution Approach 1:
The merged driver dynamically adjusts voltage parameters based on operation type: applying ground voltage during read/program operations to minimize charge leakage, and erase voltage during erase operations. This parameter optimization ensures that even with a merged driver structure, charge leakage is effectively controlled by changing voltage levels according to operational requirements.
3Loss of energy
If ground voltage is applied to common source line and bulk during read/program operations, then charge leakage is reduced, but erase operation capability is affected
Solution Approach 1:
The merged driver dynamically switches between different voltage modes based on the operation being performed: ground voltage mode during read and program operations to reduce charge leakage, and erase voltage mode during erase operations to enable proper erase functionality. This dynamic adaptation allows the system to optimize for charge leakage reduction when needed while maintaining full operational versatility across all memory operations.
Data Source
AI summary
A three-dimensional (3D) non-volatile memory includes a memory cell array and a merge driver configured to apply a merge voltage at the same level to a common source line and a bulk in the memory cell array.


