Semiconductor Device With Merged Inverter Circuits for Motor Drive

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Solution Overview

Problem

Existing semiconductor devices require separate packages for motor driving inverters with different rated outputs, leading to suboptimal cost, cooling efficiency, and size optimization due to the need for multiple coolers and increased space and cost for peripheral devices.

Innovation Solution

A semiconductor device with multiple inverter circuits, each having different current capacities, is developed, where first and second switching element chips and diode chips are mounted on a printed wiring board to form distinct inverter circuits, with the second inverter circuit having higher current capacity components to accommodate motors with larger rated outputs, optimizing cooling efficiency and miniaturization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If separate semiconductor devices are used for motors with different rated outputs, then each motor can be driven with appropriate current capacity, but the number of coolers increases and space efficiency deteriorates

Engineering Contradiction:

Improveadaptability to different motor rated outputsVSAvoidspace occupied by multiple semiconductor devices and coolers

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent combines multiple inverter circuits with different current capacities into a single semiconductor device package. Specifically, it integrates a first inverter circuit with a first cooler and a second inverter circuit with a second cooler into one unified package, allowing multiple motors with different rated outputs to be driven by one semiconductor device, thereby reducing the total number of coolers and improving space efficiency

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The semiconductor device achieves multi-functionality by incorporating multiple inverter circuits with different current capacities (first inverter circuit with current capacity I1 and second inverter circuit with current capacity I2 where I2 > I1) within a single package, enabling the device to adapt to and drive different types of motors with varying rated outputs using appropriate inverter circuits

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If multiple separate semiconductor devices are prepared, then each device can be optimized for its specific motor, but manufacturing cost and device complexity increase

Engineering Contradiction:

Improvededicated inverter circuits for different motorsVSAvoidnumber of separate semiconductor devices required

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent merges multiple inverter circuits that would traditionally require separate semiconductor devices into a single integrated package. The package contains both the first inverter circuit (for the first motor) and the second inverter circuit (for the second motor), along with their respective coolers, control circuits, and connection terminals, all within one unified structure, thereby reducing device complexity while maintaining dedicated optimization for each motor type

Inventive Principle:

Principle #5Merging (Combining)

3Temperature

If separate semiconductor devices are used, then each device can have optimized cooling, but the number of coolers increases and cooling efficiency deteriorates

Engineering Contradiction:

Improvecooling efficiency for each semiconductor deviceVSAvoidnumber of coolers required

Core Design Contradiction:

TemperatureVSQuantity of substance

Solution Approach 1:

The patent combines multiple cooler units into a single semiconductor device package. Specifically, it integrates a first cooler coupled to the first inverter circuit and a second cooler coupled to the second inverter circuit within the same package, allowing for optimized cooling of each inverter circuit while reducing the total quantity of cooler units from two separate devices to one integrated package

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS20240106341A1Semiconductor device

Publication Date: 2024.03.28 MITSUBISHI ELECTRIC CORP

AI summary

In a semiconductor device, a plurality of first switching element chips and a plurality of first diode chips constituting a first inverter circuit, and a plurality of second switching element chips and a plurality of second diode chips constituting a second inverter circuit are mounted on a printed wiring board incorporated into a package. At this point, a current capacity of each of the plurality of second switching element chips is greater than a current capacity of each of the plurality of first switching element chips, and a current capacity of each of the plurality of second diode chips is greater than a current capacity of each of the plurality of first diode chips.