Merged Optical Inspection and Component Placement System
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Solution Overview
Problem
The high costs and large space requirements associated with separate machines for Automated Optical Inspection (AOI) in substrate component placement processes, especially for small placement contents, necessitate a more cost-effective and space-efficient solution for inspecting the quality of substrates.
Innovation Solution
Integration of an optical inspection system, including a movable camera, with the X-Y positioning system and component holding device in an automatic placement machine, eliminating the need for separate AOI machines and allowing for parallelization of component placement and inspection processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If separate AOI machines are used for inspecting substrates, then inspection quality is ensured, but manufacturing space and costs increase significantly
Solution Approach 1:
The patent combines the AOI inspection system with the component placement machine by integrating a camera and inspection software into the existing X-Y positioning system. The camera is mounted on the placement head carrier, allowing inspection functions to be performed using the same positioning infrastructure, thereby eliminating the need for separate AOI machines and reducing manufacturing space requirements
Solution Approach 2:
The X-Y positioning system and carrier structure are designed to serve dual purposes: component placement and optical inspection. The camera is integrated onto the same carrier that holds the component holding device, enabling the system to perform both placement and inspection functions without requiring separate positioning infrastructure, thus reducing space and cost
2Measurement precision
If separate AOI machines are used for inspecting substrates, then inspection quality is ensured, but manufacturing costs increase
Solution Approach 1:
The patent combines the AOI inspection system with the component placement machine by integrating a camera and inspection software into the existing X-Y positioning system. The camera is mounted on the placement head carrier, allowing inspection functions to be performed using the same positioning infrastructure, thereby eliminating the need for separate AOI machines and reducing manufacturing space requirements
Solution Approach 2:
The X-Y positioning system and carrier structure are designed to serve dual purposes: component placement and optical inspection. The camera is integrated onto the same carrier that holds the component holding device, enabling the system to perform both placement and inspection functions without requiring separate positioning infrastructure, thus reducing space and cost
3Device complexity
If sequential processing is used for component placement and inspection, then equipment simplicity is maintained, but productivity decreases
Solution Approach 1:
The patent implements dynamic parallel processing by enabling the camera and component holding device to operate simultaneously on different substrates. The system can inspect one substrate while placing components on another, utilizing the same X-Y positioning system for both operations. This dynamic approach increases throughput without significantly increasing equipment complexity
Solution Approach 2:
The system maintains continuous productive action by eliminating idle time between placement and inspection operations. While the component holding device is placing components on one substrate, the camera simultaneously inspects another substrate, ensuring that both systems are continuously productive without waiting for sequential completion
Data Source
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AI summary
The device (100) has a component with a x-y-positioning system (104). The x-y-z-positioning system has a x-carrier (108), and the component holding device (102) is movably arranged in the x-carrier. An optical inspection system is provided for inspecting a substrate (124) with a camera (120) that is movably arranged in the x-carrier. The component holding device and the camera are arranged at various longitudinal side surfaces of an elongated x-carrier. An independent claim is also included for a method for assembling of substrates.