Mesa Contact Plug Structure for Narrow-Trench Power Semiconductors

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

As the width of the mesa in power semiconductor devices becomes smaller, it becomes more difficult to reliably contact the mesa using a contact plug structure.

Innovation Solution

The implementation of a protection structure between the contact plug and the trench electrode of the first trench allows for a reliable contact with the mesa, even with a small mesa width, by providing electrical insulation and enabling a shared contact scheme where the trench electrode adjacent to the mesa is not connected to the emitter potential but to another potential like the gate potential.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of moving object

If the mesa width is reduced, then the device integration density is improved, but the reliability of contact plug structure deteriorates

Engineering Contradiction:
Improvemesa widthVSAvoidcontact reliability
Core Design Contradiction:
Area of moving objectVSReliability

Solution Approach 1:

The patent introduces a protection structure as an intermediary element between the contact plug and the trench electrode. This protection structure, formed by depositing dielectric material and selectively removing portions, acts as a mediator that enables the contact plug to reliably contact the mesa region even when the mesa width is reduced. The protection structure provides mechanical support and electrical isolation, allowing the contact plug to bridge across the narrowed mesa width without compromising contact reliability.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Area of moving object

If the mesa width is reduced, then the device integration density is improved, but the manufacturing complexity increases

Engineering Contradiction:
Improvemesa widthVSAvoidcontact structure complexity
Core Design Contradiction:
Area of moving objectVSDevice complexity

Solution Approach 1:

The patent segments the contact structure into distinct functional components: the contact plug, the protection structure, and the trench electrode. The protection structure itself is segmented through selective removal of dielectric material in specific regions. This segmentation allows each component to be optimized independently - the contact plug for electrical connection, the protection structure for isolation and support, and the trench electrode for field control - thereby managing the overall complexity while enabling reduced mesa width.

Inventive Principle:
Principle #1Segmentation

3Reliability

If a protection structure is added, then the contact reliability with small mesa width is improved, but the device complexity increases

Engineering Contradiction:
Improvecontact reliabilityVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The protection structure serves multiple functions simultaneously: it provides electrical isolation between the contact plug and trench electrode, mechanical support for the contact plug structure, and defines the lateral boundaries of the contact region. By consolidating these multiple functions into a single structural element formed through standard semiconductor processing steps (dielectric deposition and selective removal), the patent improves contact reliability without proportionally increasing device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS12237381B2Mesa contact for MOS controlled power semiconductor device and method of producing a power semiconductor device
Publication Date: 2025.02.25 INFINEON TECHNOLOGIES AG
  • US12237381B2 patent drawing
  • US12237381B2 patent drawing
  • US12237381B2 patent drawing

AI summary

A power semiconductor device includes: a semiconductor body having a first surface and a mesa portion that includes a surface part of the first surface and a body region; at least two trenches extending from the first surface into the semiconductor body along a vertical direction, each trench including a trench electrode and trench insulator insulating the trench electrode from the semiconductor body, the mesa portion being laterally confined by the trenches in a first vertical cross-section along a first lateral direction; and a contact plug in contact with the body region. The contact plug and trench electrode of a first trench laterally overlap at least partially in the first vertical cross-section. A protection structure having a portion arranged within the first trench is arranged between the contact plug and trench electrode of the first trench. The protection structure may be an electrically insulation structure or a protective device structure.