Semiconductor Mesa Edge Concaves for LED Light Extraction
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Solution Overview
Problem
Existing light-emitting devices face challenges in improving light extraction efficiency and production yield, while also enhancing the reliability of package apparatuses.
Innovation Solution
A light-emitting device with a semiconductor stack on a substrate, featuring a pattern on the side surface of the semiconductor stack and an identification pattern for improved light extraction efficiency and production yield, along with a package apparatus design for enhanced reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional planar semiconductor structure is used, then the device structure is simple, but the light extraction efficiency is low
Solution Approach 1:
The patent introduces concave portions with curved surfaces on the semiconductor mesa structure. These curved surfaces increase the optical path length and scattering of emitted light, thereby improving light extraction efficiency. The curvature modifies the conventional planar structure to enhance optical performance without significantly complicating the manufacturing process.
Solution Approach 2:
The patent applies concave portions selectively at specific locations (edges and corners) of the semiconductor mesa rather than uniformly across the entire structure. This localized modification optimizes light extraction from regions where it is most beneficial while maintaining structural simplicity and ease of manufacture in other areas.
2Ease of manufacture
If conventional cutting methods are used, then the cutting process is simple, but the production yield is reduced due to difficulty in identifying chip orientation
Solution Approach 1:
The patent introduces identification patterns (such as differently colored or reflective regions) on the semiconductor wafer that allow automated optical inspection systems to easily identify chip orientation and positioning. These visual markers enable precise alignment during the cutting process, reducing defects and improving production yield without complicating the cutting method itself.
3Ease of operation
If electrode pads are formed on opposite sides of the device, then the electrical connection is straightforward, but the package reliability is reduced
Solution Approach 1:
The patent forms both first and second electrode pads on the same side of the semiconductor device, enabling them to serve multiple functions: electrical connection and mechanical anchoring. This configuration allows the electrode pads to simultaneously provide electrical pathways and structural support, enhancing package reliability while maintaining ease of electrical connection.
Solution Approach 2:
The patent combines the electrical connection function and mechanical support function into a single location (the same side of the device). By merging these functions, the electrode pads become integral structural elements that improve package reliability while maintaining straightforward electrical connectivity.
Data Source
AI summary
A light-emitting device includes a substrate including a top surface, a first side surface and a second side surface, wherein the first side surface and the second side surface of the substrate are respectively connected to two opposite sides of the top surface of the substrate; a semiconductor stack formed on the top surface of the substrate, the semiconductor stack including a first semiconductor layer, a second semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer; a first electrode pad formed adjacent to a first edge of the light-emitting device; and a second electrode pad formed adjacent to a second edge of the light-emitting device, wherein in a top view of the light-emitting device, the first edge and the second edge are formed on different sides or opposite sides of the light-emitting device, the first semiconductor layer adjacent to the first edge includes a first sidewall directly connected to the first side surface of the substrate, and the first semiconductor layer adjacent to the second edge includes a second sidewall separated from the second side surface of the substrate by a distance.