Mesa-Type Light Receiving Element with Side Face for Optical Modules
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional optical semiconductor modules with a light emitting element and a light receiving element have high production costs and reduced photosensitivity due to complex assembly procedures and the need for additional components, especially when the light receiving element is mounted parallel to the light emitting element.
Innovation Solution
An optical semiconductor module with a mesa-type light receiving element that has a light receiving face on both its upper and side faces, featuring an antireflection film on these surfaces, allowing the light emitting and receiving elements to be mounted on the same unit, reducing assembly procedures and components while maintaining high photosensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the light receiving element is mounted parallel to the light emitting element on the same mounting carrier, then the number of mounting carriers and assembly procedures is reduced, but the photosensitivity is lowered and production costs increase due to the need for additional reflection components
Solution Approach 1:
The light receiving element is designed with light receiving faces on multiple surfaces (upper face and side faces) rather than only one surface. This multi-surface configuration allows the element to receive light from different directions, achieving high photosensitivity while maintaining a parallel mounting arrangement with the light emitting element on the same carrier
2Ease of manufacture
If the light receiving element is mounted parallel to the light emitting element, then assembly procedures are simplified, but additional reflection components are required which increases production costs
Solution Approach 1:
The light receiving element integrates multiple light receiving faces (upper and side faces) into a single component structure. This merging of multiple light receiving surfaces into one element eliminates the need for separate reflection components and mounting carriers, thereby reducing both assembly procedures and total component count
3Reliability
If the mounting face of the light receiving element is perpendicular to the mounting face of the light emitting element, then light reception efficiency is improved, but separate mounting carriers are required increasing production costs
Solution Approach 1:
Instead of using a perpendicular mounting arrangement that would require separate carriers, the invention uses a parallel mounting arrangement with the light receiving element having light receiving faces on multiple dimensions (upper and side faces). This multi-dimensional light receiving capability achieves high light reception efficiency while maintaining the simpler parallel mounting configuration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration lowers production costs and achieves photosensitivity comparable to conventional structures by allowing light emitted from the side face of the light emitting element to be effectively received by the mesa-type light receiving element, enhancing signal conversion efficiency.
Implementation Method 1
a light receiving element (60) that has a light receiving face on an upper face and a side face thereof, with an antireflection film (18) being formed on the light receiving face
Implementation Method 2
The light receiving element 60 (a LD monitor) outputs an electric signal in accordance with the light intensity of the emitted light 72
Data Source
AI summary
An optical semiconductor module with a light receiving element with an upper and side light receiving face and a light emitting element mounted on the same mounting carrier. The light receiving element has a light receiving face on an upper face and a side face covered with an antireflection film. The mounting unit has the light emitting element and the light receiving element mounted so that they encompass a positional relationship that the light emitted from the light emitting element is optically connected at least on the light receiving face of the side face of the light receiving element.