Mesa Electric Resistor for Semiconductor Heat Dissipation
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Solution Overview
Problem
Semiconductor devices with heaters on mesas experience local and excessive temperature increases, which can reduce their reliability and performance.
Innovation Solution
The semiconductor device incorporates an electric resistor with a top wall and side walls on a mesa, configured such that current flows in the extending direction of the mesa, increasing the cross-sectional area of the resistor and enhancing heat dissipation, thereby inhibiting local temperature increases.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heater is placed on a mesa to heat the semiconductor device, then the heating function is achieved, but local and excessive temperature increase occurs
Solution Approach 1:
The electric resistor is configured with both a top wall on the top surface and side walls on the side surfaces of the mesa, transitioning from a single-plane heater to a three-dimensional structure. This spatial expansion allows heat to be distributed across multiple surfaces (top and lateral), preventing concentration at a single location and thereby reducing local excessive temperature increase while maintaining overall heating function.
Solution Approach 2:
The heating function is segmented into multiple heating zones by dividing the electric resistor into different wall portions (top wall and side walls). Each wall portion independently contributes to heating different regions of the semiconductor device, which distributes the thermal load and prevents localized overheating while achieving comprehensive temperature control.
2Loss of energy
If the cross-sectional area of the electric resistor is increased to improve heat dissipation, then heat management is enhanced, but the device structure becomes more complex
Solution Approach 1:
The electric resistor structure serves multiple functions simultaneously: the top wall provides heating and heat dissipation on the top surface, while the side walls provide both structural support and additional heat dissipation pathways on the lateral surfaces. This multi-functionality allows the structure to achieve enhanced heat management without requiring separate components, thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively lowers the local temperature of the mesa and adjacent areas, increasing the reliability of the semiconductor device by improving heat management and reducing the risk of excessive temperature rises.
Implementation Method 1
an electric resistor including a top wall provided on the top surface and a side wall provided on at least one of the two side surfaces, the electric resistor being configured such that a current flows in an extending direction of the mesa
Data Source
AI summary
A semiconductor device includes: a base including a base surface; a mesa protruding from the base surface in a first direction intersecting the base surface, the mesa including a top surface and two side surfaces on both sides of the top surface, and extending along the base surface; and an electric resistor including a top wall provided on the top surface and a side wall provided on at least one of the two side surfaces, the electric resistor being configured such that a current flows in an extending direction of the mesa.