Stranded Mesh BGA Interconnects Without Solder Reflow

The patent changes the physical state and material properties of the interconnect from rigid solder balls to flexible stranded mesh structures. The stranded mesh interconnects are made of flexible conductive material that can elastically deform under stress, absorbing mechanical energy from vibration and thermal expansion while maintaining electrical connectivity. This parameter change from rigid to flexible state resolves the contradiction between achieving electrical coupling and withstanding environmental stresses.

The patent replaces the thermal-mechanical soldering process with a mechanical insertion process. Instead of using high-temperature reflow to melt and attach solder balls, the stranded mesh interconnects are simply inserted into recesses in the PCB and mechanically retained. This substitution eliminates the need for high-temperature reflow equipment and complex soldering process control, significantly simplifying the manufacturing process while achieving the same electrical coupling function.

The patent segments the interconnect function into two separate components: the stranded mesh interconnect element and the PCB recess with retention mechanism. This segmentation allows the interconnect to be easily removed and replaced by simply pulling it from the recess, providing repairability similar to sockets. However, unlike complex socket architectures, this segmentation uses a simple geometric fit and mechanical retention, avoiding additional complexity while maintaining ease of repair.