Mesh Electrical Contact Elements for Small RF Inner Conductors
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Solution Overview
Problem
Connecting high-frequency circuitry, such as inner conductors of connectors or ports, to conductors or traces in RF circuits becomes increasingly difficult as the sizes of the elements diminish with increasing signal frequencies, leading to mechanical instability and suboptimal connection configurations.
Innovation Solution
A method for manufacturing electrical contact elements involves forming a structuring layer with a predefined structure on a basic layer, depositing electrically conductive material through the structuring layer to create the contact element layer, removing the structuring layer, and detaching the contact element layer from the basic layer, allowing for tailored, mesh-structured connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sliding contacts are used to connect inner conductors, then connection is achieved, but mechanical instability occurs with small diameters less than 1.0 mm
Solution Approach 1:
The patent uses a thin foil (6-100 μm thickness) as a disposable-like structure that is deposited and then removed from the basic layer. The foil serves its purpose during manufacturing to create the mesh structure, then is discarded (removed via etching or lift-off), leaving only the functional contact element. This approach enables precise control over the contact element geometry without the mechanical instability of sliding contacts on small conductors.
Solution Approach 2:
The patent changes the physical parameters of the contact element by using variable foil thickness (6-100 μm) and variable mesh aperture sizes (20-1000 μm) to optimize performance for different applications. This parameter control allows adaptation to small inner conductors while maintaining connection reliability, resolving the contradiction between stability and adaptability.
2Ease of manufacture
If uniform mesh pattern is used, then manufacturing is simplified, but optimal configuration for each electrical connection is not achieved
Solution Approach 1:
The patent applies local quality by allowing different sections of the mesh structure to have different aperture sizes, patterns, or densities according to specific connection requirements. The structuring layer can be designed with spatially varying properties, enabling each region of the contact element to be optimized for its local function while still using a single manufacturing process.
Solution Approach 2:
The patent uses a structuring layer as a preliminary template that defines the desired mesh pattern before deposition. This preliminary structure guides the deposition process to create the exact configuration needed, then the structuring layer is removed. This approach enables complex, optimized patterns to be manufactured with the simplicity of a single deposition step.
3Ease of manufacture
If gold ribbons with fixed dimensions are used, then availability is improved, but tailored configurations for specific applications are limited
Solution Approach 1:
The patent overcomes the limitation of fixed-dimension ribbons by using a deposition process with a structuring layer that allows continuous variation of foil thickness (6-100 μm), width, and mesh aperture size (20-1000 μm). This enables customization for each specific application while still using standard deposition equipment and materials, combining availability with adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the creation of ready-to-use, individually tailored electrical contact elements that can accommodate fragile RF ports with small inner conductors and vary in shape and size, providing improved mechanical flexibility and RF characteristics.
Implementation Method 1
Removing the structuring layer may e.g., be performed by applying an etching process.
Implementation Method 2
adding an electrical contact element layer by depositing electrically conductive material on the basic layer via the structuring layer
Data Source
AI summary
The present disclosure provides a method for manufacturing an electrical contact element, the method comprising forming a structuring layer with a predefined structure on a basic layer, adding an electrical contact element layer by depositing electrically conductive material on the basic layer via the structuring layer according to the predefined structure, removing the structuring layer, and detaching the electrical contact element layer from the basic layer. Further, the present disclosure provides a respective electrical contact element.