Mesh Covering Layer for Electronic Module Bending Resistance
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Solution Overview
Problem
Existing personal computer camera modules face issues with bending resistance and electromagnetic interference due to thin circuit boards, which are exacerbated by the need for customized metal shells that reduce manufacturing and rework efficiency.
Innovation Solution
An electronic module design featuring a circuit board with a mesh covering layer and adhesive, allowing for improved bending resistance and shielding, with the covering layer being easily customizable and the adhesive facilitating easy removal during rework.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a metal shell is disposed on the thin circuit board to cover the electronic components, then bending resistance and shielding effect are improved, but manufacturing flexibility and rework efficiency deteriorate
Solution Approach 1:
The covering layer is divided into a mesh structure with multiple holes rather than a solid metal shell. This segmentation allows the covering layer to be more flexible in manufacturing while still providing adequate structural support and shielding. The mesh structure can be easily cut and customized to different sizes and shapes without the limitations of metal shell fabrication.
Solution Approach 2:
The invention changes the material parameter from metal to a non-metallic covering layer material that can be more easily formed and customized. This parameter change enables better manufacturing flexibility while maintaining the essential functions of structural support and electromagnetic shielding through the mesh design and conductive layer.
2Object-affected harmful factors
If a metal shell is disposed on the thin circuit board to cover the electronic components, then bending resistance and shielding effect are improved, but rework efficiency deteriorates
Solution Approach 1:
The mesh structure with multiple holes creates a covering layer that is inherently more manageable and less damaging during removal compared to a solid metal shell. The segmented structure allows for easier manipulation and removal without exerting excessive force on the circuit board and electronic components during rework operations.
Solution Approach 2:
The covering layer is designed as a flexible, thin-film structure rather than a rigid metal shell. This flexibility enables the covering layer to be more easily removed and repositioned during rework without causing damage to underlying components, while still providing effective electromagnetic shielding when in place.
3Adaptability or versatility
If the covering layer is made as a mesh structure with multiple holes, then manufacturing flexibility is improved, but structural strength may deteriorate
Solution Approach 1:
The invention uses a composite structure combining the mesh covering layer with an adhesive layer and optionally a conductive layer. This composite approach allows the mesh structure to provide flexibility and ease of manufacturing, while the adhesive and conductive layers contribute to overall structural strength and functional performance.
Solution Approach 2:
The adhesive is applied in advance to the covering layer or circuit board before assembling the covering layer onto the circuit board. This preliminary action ensures proper bonding and structural integrity are established before the covering layer is subjected to any stress or manipulation during subsequent manufacturing or rework operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances bending resistance and manufacturing flexibility while maintaining high rework efficiency and yield by using a mesh covering layer with holes and a conductive layer for electromagnetic shielding.
Implementation Method 1
The adhesive is combined between upper and lower edges of the covering layer and the at least one electronic component, and the adhesive fills the holes and encapsulates the at least one electronic component
Implementation Method 2
the electronic module further includes a conductive layer, and the conductive layer encapsulates the covering layer and the adhesive
Data Source
AI summary
An electronic module is provided, including a circuit board, at least one electronic component, a covering layer, and an adhesive. The at least one electronic component is disposed on the circuit board. The covering layer has multiple holes, and the covering layer is disposed on the circuit board and covers the at least one electronic component. The adhesive is combined to the covering layer, and the adhesive fills the holes and encapsulates the at least one electronic component.