Mesh Electrode Adhesion Structure for Electron Emission Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High electric fields in electron emission devices can compromise the structural stability between the cathode and the gate electrode, leading to detachment of the mesh electrode from the insulation layer.
Innovation Solution
A mesh electrode adhesion structure is developed with combination grooves and an adhesion layer, where the adhesion layer includes glass materials, and the grooves are designed to enhance the adhesion by varying widths and angles, ensuring stable attachment even under high electric fields.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a high electric field is applied to enable electron emission device operation, then electron emission function is improved, but structural stability between cathode and gate electrode deteriorates
Solution Approach 1:
An adhesion layer is introduced as an intermediary component between the mesh electrode and the substrate. This adhesion layer serves as a mediator that strengthens the bond between the two components, preventing detachment caused by high electric fields while allowing the electron emission function to operate effectively.
Solution Approach 2:
Combination grooves are defined in the mesh electrode to create a multi-dimensional adhesion structure. The grooves extend in multiple directions, increasing the contact area and mechanical interlocking between the mesh electrode and the adhesion layer, thereby enhancing structural stability without compromising electron emission performance.
2Device complexity
If the mesh electrode is directly attached to the substrate, then device structure is simple, but adhesion strength is insufficient under high electric fields
Solution Approach 1:
An adhesion layer is introduced as an intermediary component between the mesh electrode and the substrate. This adhesion layer serves as a mediator that strengthens the bond between the two components, preventing detachment caused by high electric fields while allowing the electron emission function to operate effectively.
Solution Approach 2:
The adhesion layer is formed using glass materials that combine multiple properties: chemical bonding capability with both the substrate and mesh electrode, thermal stability during fabrication processes, and mechanical strength to resist detachment forces. This composite structure provides superior adhesion strength compared to direct attachment.
3Strength
If combination grooves are defined in the mesh electrode to enhance adhesion, then adhesion load increases significantly, but manufacturing complexity increases
Solution Approach 1:
The mesh electrode is segmented by defining combination grooves that divide the continuous structure into distinct regions. These grooves create multiple adhesion points distributed across the electrode surface, increasing overall adhesion load while maintaining manufacturability through standard fabrication techniques.
Solution Approach 2:
The depth, width, and spacing of the combination grooves are optimized to achieve the desired adhesion load. By carefully controlling these geometric parameters, the structure achieves maximum adhesion strength while remaining compatible with existing manufacturing processes and minimizing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced adhesion structure significantly increases the stability of the mesh electrode to the insulation layer, as demonstrated by a 4.24 times higher adhesion load compared to devices without combination grooves, maintaining reliable operation under high voltage conditions.
Implementation Method 1
an adhesion layer between the substrate and the mesh electrode
Data Source
AI summary
A mesh electrode adhesion structure includes: a substrate, and an opening defined in the substrate; a mesh electrode on the substrate, and a first combination groove defined in the mesh electrode; and an adhesion layer between the substrate and the mesh electrode. The mesh electrode includes: a mesh region corresponding to the opening defined in the substrate, and an adhesion region in which the first combination groove exposes the adhesion layer.


