Mesh Electrode Chuck Layout for Uniform Plasma Processing

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Solution Overview

Problem

Conventional substrate support devices with mesh structures suffer from randomness in current paths and impedance differences between edges, leading to non-uniformity in plasma processing.

Innovation Solution

A substrate support device with a new mesh structure design, featuring a first mesh electrode and a second mesh electrode divided into sub-mesh electrodes, along with a chucking circuit for DC voltage application and an edge control circuit for RF control, to remove induced electromotive forces and ensure uniform current paths.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a conventional mesh structure with one or two mesh electrodes is used, then the device complexity is reduced, but the manufacturing precision and uniformity of plasma processing deteriorate due to random current paths and impedance differences between edges

Engineering Contradiction:

Improvemesh electrode structureVSAvoiduniformity of plasma processing

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

The second mesh electrode is divided into multiple second sub-mesh electrodes (e.g., four segments) arranged in a specific pattern. This segmentation eliminates the random current paths and impedance differences present in conventional single or two-electrode designs, thereby improving the uniformity of plasma processing while maintaining reasonable device complexity.

Inventive Principle:

Principle #1Segmentation

2Manufacturing precision

If the second mesh electrode is divided into multiple sub-mesh electrodes, then the uniformity of current paths and plasma processing is improved, but the device complexity increases

Engineering Contradiction:

Improveuniformity of current pathsVSAvoidmesh electrode structure

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The second sub-mesh electrodes are arranged in an asymmetric pattern rather than simple radial segmentation. This asymmetric arrangement optimizes the current distribution and eliminates induced electromotive forces more effectively than symmetric designs, achieving better uniformity with manageable complexity.

Inventive Principle:

Principle #4Asymmetry

Solution Approach 2:

The patent introduces a specific spatial arrangement of the second sub-mesh electrodes that considers both radial and angular dimensions. By optimizing the positioning in multiple dimensions, the design achieves uniform current distribution while controlling the number of electrode segments to avoid excessive complexity.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Device complexity

If a conventional mesh structure is used, then the device design is simple, but induced electromotive forces are generated due to closed loops, causing non-uniformity in the deposition process

Engineering Contradiction:

Improvemesh electrode structureVSAvoidconsistency of deposition process

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

By dividing the second mesh electrode into multiple isolated sub-mesh electrodes, the continuous closed loops are broken into separate segments. This segmentation prevents the formation of large closed loops that generate significant induced electromotive forces, thereby improving the consistency of the deposition process.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent extracts and eliminates the harmful closed-loop structures from the electrode design. By removing the continuous conductive paths that form closed loops, the source of induced electromotive forces is eliminated, improving deposition uniformity.

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The new mesh structure design enhances uniformity control in plasma processing by removing randomness in current paths and impedance differences, thereby improving the consistency and efficiency of the deposition process.

Implementation Method 1

radio frequency (RF) power is applied between electrodes to excite a process gas into plasma for depositing a wafer in the reaction chamber

Methodology Applied

Scientific EffectRadio frequency plasma excitation: Plasma

Implementation Method 2

a chucking circuit configured to apply a DC voltage to the first mesh electrode

Methodology Applied

Scientific EffectElectrostatic force: Electrostatics

Data Source

PatentUS12233501B2Substrate support device

Publication Date: 2025.02.25 TES CO LTD

AI summary

There is provided a substrate support device. The substrate support device includes a substrate support part on which a wafer is deposited, the substrate support part including a first mesh electrode and a second mesh electrode disposed under the first mesh electrode; a chucking circuit configured to apply a DC voltage to the first mesh electrode; and an edge control circuit configured to control timings of operations related to the first mesh electrode and the second mesh electrode and control RF (Radio Frequency). The second mesh electrode is divided into a plurality of second sub-mesh electrode to remove an induced electromotive force generated due to a closed loop.