Circuit Board Mesh Ground Layers for Crosstalk and Impedance Control
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Solution Overview
Problem
Crosstalk and impedance issues arise in circuit boards during high-speed signal transmission, affecting signal integrity.
Innovation Solution
A circuit board design featuring a mesh-structured conductor layer electrically grounded and electrically opened layers with voids, strategically positioned to reduce crosstalk and achieve impedance matching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If high-speed signals are exchanged through the circuit board, then communication speed is improved, but crosstalk increases
Solution Approach 1:
The circuit board is divided into multiple conductor layers with different configurations. Signal layers are segmented from ground layers, and the ground layers are further segmented into mesh structures and void regions. This segmentation allows high-speed signal transmission while isolating crosstalk through strategic layer separation and grounding patterns.
Solution Approach 2:
Ground layers serve as intermediary elements between signal layers. The mesh-structured ground layers and void regions act as mediators that shield signal paths from electromagnetic interference, reducing crosstalk while maintaining signal integrity for high-speed communication.
2Ease of manufacture
If conventional circuit board design is used, then manufacturing is simple, but impedance matching is poor
Solution Approach 1:
Different regions of the circuit board have different ground layer configurations. Mesh-structured ground layers are placed in specific areas where impedance control is critical, while void regions are positioned where signal isolation is needed. This local differentiation achieves precise impedance matching without complicating the overall manufacturing process.
Data Source
AI summary
The present disclosure relates to an electronic circuit. A circuit board according to the present disclosure includes a first conductor layer including a first pad for transmitting and receiving a first signal to and from an external device, a plurality of second conductor layers stacked on the first conductor layer, and a third conductor layer stacked on the plurality of second conductor layers and including a second pad for transmitting and receiving a second signal to and from the external device, wherein at least one target conductor layer among the plurality of second conductor layers has a mesh structure and is electrically grounded, and remaining second conductor layers except for the at least one target conductor layer include respective voids and are electrically opened.