Circuit Board Mesh Heating Wire for Uniform Probe Card Heating
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Solution Overview
Problem
Existing circuit boards for probe cards experience uneven heat generation due to non-uniform distribution of through holes in the heating wire, leading to temperature variations across the board surface.
Innovation Solution
A circuit board design featuring a mesh-shaped heating wire with alternating first and second through holes, allowing circuit conductors to pass through some holes while avoiding contact, ensuring uniform heat distribution by distributing through holes uniformly across the heating wire.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through holes are provided in the heating wire to prevent contact with circuit conductors, then electrical insulation is improved, but heat distribution becomes uneven
Solution Approach 1:
The heating wire is segmented into multiple sections with through holes distributed along its length. This segmentation allows the heating wire to maintain electrical insulation at multiple points while distributing heat generation across different sections, preventing localized overheating and achieving more uniform heat distribution across the circuit board surface.
Solution Approach 2:
Through holes are strategically positioned at specific locations along the heating wire where circuit conductors are present. This local quality approach ensures that electrical insulation is provided precisely where needed (at conductor intersections) while maintaining continuous heat generation along the entire heating wire length, resolving the conflict between insulation requirements and heat uniformity.
2Temperature
If the heating wire is positioned in interlayer regions to enable heating, then heating function is improved, but risk of contact with circuit conductors increases
Solution Approach 1:
The ceramic insulating layers serve as intermediary barriers between the heating wire and circuit conductors. The heating wire is embedded within these interlayer regions, using the ceramic material as a mediator that provides both mechanical support and electrical insulation, enabling the heating wire to function close to conductors without direct contact.
Solution Approach 2:
The heating wire is nested within the multi-layer ceramic insulating structure. This nesting arrangement places the heating wire inside the protected interlayer regions, surrounded by insulating ceramic material on multiple sides, which prevents contact with circuit conductors while maintaining proximity for effective heating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves uniform heating across the board surface, reducing temperature variations and enhancing the reliability and efficiency of the heating process.
Implementation Method 1
a circuit board having a heating element (heating wire) is known... The circuit board and a probe card can be heated by the heating wire disposed in the circuit board being caused to generate heat
Data Source
AI summary
A circuit board has: an insulating substrate formed by plural ceramic insulating layers being layered on one another and having a first surface and a second surface on the opposite side to the first surface; a circuit conductor passing through the inside of the insulating substrate and positioned in a region from the first surface to the second surface; and at least one heating wire positioned in the insulating substrate. The heating wire is positioned in, among plural interlayer regions between the ceramic insulating layers, at least one interlayer region between the ceramic insulating layers and has a mesh shape having plural first through holes through which a portion of the circuit conductor passes and having plural second through holes through which the circuit conductor does not pass.