Electronic Package Mesh Interconnect for Thin-Circuit IR Drop
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Solution Overview
Problem
Conventional semiconductor packages with copper circuits suffer from significant IR drop due to the thinness of the circuit, leading to inadequate power delivery through electrode pads serving as power sources.
Innovation Solution
The introduction of a mesh structure between the electronic element and the circuit structure, which is electrically connected to a conductive sheet and electrode pads, increases the shunt path of current, allowing power to be efficiently passed through a conductive area composed of the mesh structure and conductive bumps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the circuit structure is designed to be thin to meet miniaturization requirements, then the packaging size is reduced, but the IR drop increases and power delivery becomes inadequate
Solution Approach 1:
The patent transitions from a planar two-dimensional circuit layout to a three-dimensional structure by stacking multiple circuit layers vertically. This dimensional change allows the circuit to maintain thin profile in the horizontal plane while increasing conductive path area in the vertical dimension, thereby reducing IR drop without increasing packaging footprint
Solution Approach 2:
The patent employs composite material structures combining different conductive layers (copper circuits on ceramic substrate, gold bonding wires, solder balls) with varying electrical and thermal properties. This composite approach optimizes power delivery by utilizing materials with complementary characteristics to reduce overall resistance and heat generation
2Reliability
If copper circuits are used in the circuit structure, then conductivity is improved, but power loss increases when the circuit is extremely thin
Solution Approach 1:
By stacking multiple copper circuit layers vertically separated by dielectric layers, the patent increases the effective cross-sectional area for current flow without increasing horizontal dimensions. This multi-layer approach maintains high copper conductivity while reducing overall power loss through increased conductive path area
Solution Approach 2:
The patent merges multiple conductive elements (copper traces, gold bonding wires, solder balls) into an integrated power delivery network. This combination of different conductive paths working together reduces overall resistance and power loss compared to relying on a single thin copper layer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces power loss and ensures that the IR drop of the electronic element meets the required specifications, even when the circuit structure is designed to be thin.
Implementation Method 1
the mesh structure is electrically connected to the conductive sheet and at least the other one of the plurality of electrode pads, wherein the mesh structure has a plurality of interlaced strips to form a plurality of mesh holes corresponding to the plurality of electrode pads
Data Source
AI summary
An electronic package is provided, in which a mesh structure is disposed between a circuit structure and an electronic element to increase the shunt path of current. Therefore, when the electronic element is used as an electrode pad of a power contact, the current can be passed through a conductive sheet of the circuit structure via the mesh structure, such that the power loss can be reduced and the IR drop of the electronic element can meet the requirements.