Mesh Network Thermal Control System with Integrated Heat Spreaders
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Solution Overview
Problem
Designing an efficient thermal-control system for mesh network devices that maintains a small form factor while effectively dissipating heat generated by integrated circuit devices to prevent degradation, which is challenging due to the need for efficient heat transfer and dissipation.
Innovation Solution
A thermal-control system integrated into mesh network devices, comprising a cylindrical heat sink, planar heat spreaders, and a heat shield, which transfers heat from IC devices on a PCB to a housing component for external dissipation using conduction, convection, and radiation mechanisms, with a fan mechanism to enhance heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a thermal-control system is added to dissipate heat from IC devices, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple thermal management functions (heat sinking, heat spreading, heat shielding) into a single integrated thermal-control system that is incorporated into the mesh network device housing. This merging approach improves heat dissipation efficiency while minimizing the increase in device complexity by consolidating thermal management components into one cohesive system rather than using separate independent components.
Solution Approach 2:
The thermal-control system is designed to serve multiple functions simultaneously: the heat sink dissipates heat from IC devices, the heat spreader distributes thermal energy across larger areas, and the heat shield protects sensitive components from thermal exposure. This multi-functionality allows the system to address various thermal management needs within a single integrated structure, improving overall heat dissipation efficiency without proportionally increasing complexity.
2Volume of moving object
If the mesh network device is made compact with small form factor, then device size is reduced, but heat dissipation capability deteriorates
Solution Approach 1:
The patent employs heat spreaders that extend thermal energy distribution across two-dimensional surfaces within the compact device volume. By transitioning heat management from purely vertical (one-dimensional) conduction through IC devices to two-dimensional spreading across heat spreader surfaces, the system maintains effective heat dissipation capability while preserving the compact small form factor of the mesh network device.
Solution Approach 2:
The thermal-control system components are nested within the existing housing structure of the mesh network device. The heat sink, heat spreader, and heat shield are arranged in a nested configuration where components are positioned within the available internal volume of the compact device, allowing effective heat dissipation without increasing the overall device size.
3Temperature
If heat is transferred to housing component for external dissipation, then internal thermal management is improved, but housing component temperature increases
Solution Approach 1:
The heat shield is strategically positioned to provide localized thermal protection to specific areas of the housing component and internal components that are sensitive to heat. By applying heat shielding selectively where needed rather than uniformly across the entire housing, the system improves internal thermal management while minimizing the temperature increase of the housing component in critical areas.
Solution Approach 2:
The heat shield acts as an intermediary barrier between the heat-generating IC devices and the housing component. It intercepts and redirects thermal energy away from the housing, allowing heat to be transferred to the housing component for external dissipation while the shield protects specific areas from excessive temperature rise, thus improving internal thermal management without uniformly increasing housing temperature.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system maintains a desired thermal profile by effectively dissipating heat from IC devices, keeping surface temperatures below 67°C and junction temperatures within safe thresholds, even in ambient conditions of 25°C, thus preventing thermal runaway and damage to electronic subsystems.
Implementation Method 1
transfers heat generated by IC devices, populating a PCB of the mesh network device, to a housing component of the mesh network device for external dissipation
Implementation Method 2
a first heat spreader that is generally planar and attached to a first surface of the interior disk-like body
Implementation Method 3
a fan mechanism that is located between the internal cavity region and the first surface of the heat sink. The fan mechanism has one or more blades that rotate about the central axis
Implementation Method 4
transfers heat generated by IC devices, populating a PCB of the mesh network device, to a housing component of the mesh network device for external dissipation
Data Source
AI summary
This document describes a thermal-control system (110) that may be integrated into a mesh network device (102) and associated mesh network devices. The thermal-control system (110), which may include a heat sink (112), multiple heat spreaders (114, 118), and a heat shield (116), is such that heat (106) originating from IC devices populating a printed circuit board (104) of the mesh network device (102) may be transferred to a housing component (108) of the mesh network device (102) for external dissipation to maintain a desired thermal profile of the mesh network device (102).