Mesh Sheet Adhesion for Power Module Leakage
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Solution Overview
Problem
In power semiconductor modules, insufficient adhesion between the metal plate and the resin case can lead to leakage of the sealing material, affecting the module's reliability and heat conduction, and existing solutions face challenges in maintaining adhesion over time without increasing manufacturing costs or compromising productivity.
Innovation Solution
The implementation of a mesh-shaped resin sheet and a low-viscosity adhesive agent, where the adhesive is applied on the sheet and retained by surface tension, enhances adhesion between the metal plate and the resin case, preventing leakage and improving reliability while allowing for efficient manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive is applied directly to the metal plate surface, then adhesion between metal plate and resin case is achieved, but the adhesive spreads and thins out over time causing insufficient adhesion
Solution Approach 1:
A mesh-shaped sheet is introduced as an intermediary layer between the metal plate and the adhesive. The sheet has mesh portions that allow adhesive to penetrate and form adhesive portions, while the sheet itself provides structural support and prevents adhesive from spreading excessively. This intermediary structure maintains adhesive concentration and bonding strength over time.
Solution Approach 2:
The mesh-shaped sheet functions as a thin film structure that controls adhesive distribution. The sheet's flexible yet stable structure allows it to conform to the metal plate surface while maintaining its mesh pattern, ensuring consistent adhesive retention and preventing adhesive thinning over time.
2Strength
If adhesive is applied in sufficient quantity to ensure adhesion, then strong bonding is achieved, but excess adhesive increases manufacturing cost and complexity
Solution Approach 1:
The mesh-shaped sheet creates localized adhesive application areas through its mesh structure. Adhesive is applied only in the mesh portions where it can penetrate and bond, rather than requiring uniform adhesive coverage across the entire surface. This localized approach ensures sufficient bonding strength while reducing total adhesive quantity and manufacturing complexity.
Solution Approach 2:
The mesh-shaped sheet acts as a porous structure with open spaces that allow adhesive to penetrate and anchor. The porous mesh design enables efficient adhesive retention without requiring large volumes of adhesive, achieving strong bonding with minimal material and simplified manufacturing.
3Reliability
If adhesive is applied early in the process, then adhesion is established, but strict time management is required to prevent adhesive drying or degradation
Solution Approach 1:
The mesh-shaped sheet is pre-installed on the metal plate before adhesive application. This preliminary placement creates a ready structure that guides adhesive application and ensures immediate adhesive retention upon application. The pre-positioned sheet eliminates the need for strict time management during adhesive application since the sheet is already in place to capture and hold the adhesive.
4Reliability
If traditional adhesive application methods are used, then adhesion is achieved, but sealing material may leak out due to insufficient adhesion
Solution Approach 1:
The mesh-shaped sheet serves as an intermediary reinforcement layer that enhances the adhesive bond between the metal plate and resin case. This intermediate structure prevents adhesion failure that would otherwise allow sealing material to leak, providing an additional mechanical barrier and bonding interface.
Solution Approach 2:
The bonding system becomes a composite structure combining the metal plate, mesh-shaped sheet, and adhesive in a multi-layer configuration. This composite construction provides superior adhesion and sealing performance compared to simple adhesive application, preventing sealing material leakage through enhanced structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures strong and consistent adhesion between the metal plate and the resin case, preventing sealing material leakage and enhancing the module's reliability, while reducing the need for strict time management and minimizing manufacturing costs, thus improving productivity.
Implementation Method 1
the adhesive is applied on the sheet and retained by surface tension
Data Source
AI summary
A semiconductor device according to an embodiment includes a metal plate, a semiconductor chip, an insulating substrate provided between the metal plate and the semiconductor chip, a frame body surrounding the insulating substrate, a mesh-shaped sheet provided between the metal plate and the frame body, an adhesive agent provided between the metal plate and the frame body, and a sealing material being surrounded by the frame body and covering the semiconductor chip and the insulating substrate.