Mesh-Plated Vapor Reflow for Fine-Pitch Temperature Profiling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The vapor phase soldering method faces challenges in precisely controlling the temperature profile, especially as the pitch between solders decreases, leading to difficulties in achieving uniform temperature distribution across substrates.
Innovation Solution
A solder reflow apparatus is designed with a vapor generating chamber, a heater, and a substrate stage that is movable. The apparatus includes mesh plates with varying opening sizes to regulate vapor density and create distinct temperature zones within the chamber, allowing for precise control of the temperature profile.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If vapor phase soldering is used to provide uniform temperature distribution, then temperature uniformity is improved, but temperature profile control precision deteriorates due to vapor density gradient variations
Solution Approach 1:
The patent introduces mesh plates with varying opening sizes at different vertical positions to create localized vapor density adjustments. The mesh plates have different opening ratios (e.g., 30-70% openness) to regulate vapor flow locally, enabling different temperature profiles in different zones while maintaining overall uniformity. This resolves the contradiction by making the temperature field spatially adaptive rather than uniformly static.
Solution Approach 2:
The patent makes the vapor density distribution dynamic and adjustable by using mesh plates with controllable opening configurations. The system can adjust vapor flow patterns in real-time to match different soldering requirements, transforming the static vapor phase process into a dynamically controllable system that adapts to varying pitch and temperature profile needs.
2Productivity
If the pitch between solders is decreased to increase component density, then device integration is improved, but temperature profile control precision deteriorates due to vapor density gradient variations
Solution Approach 1:
The mesh plates create localized vapor density zones that can be optimized for fine-pitch soldering. By adjusting the opening sizes and distributions in different vertical layers, the system provides tailored vapor flow patterns that maintain precise temperature control even when solders are closely spaced, enabling high-density integration without sacrificing soldering quality.
Solution Approach 2:
The vapor generating chamber is segmented into multiple vertical zones by the mesh plates, each zone capable of independent vapor density control. This segmentation allows the system to handle different pitch requirements in different spatial regions, supporting both fine-pitch and coarse-pitch soldering within the same chamber through zoned vapor distribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the reduction of defects in the reflow process for solders at fine pitches and improves joint quality by achieving a desired temperature gradient across the substrate.
Implementation Method 1
a heater configured to heat the heat transfer fluid to generate saturated vapor from the heat transfer liquid
Implementation Method 2
a vapor generating chamber configured to have a saturated vapor generated from the heat transfer fluid distributed based on a density difference
Data Source
AI summary
An apparatus includes: a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated by the heat transfer fluid; a heater configured to heat the heat transfer fluid in the vapor generating chamber; a substrate stage configured to be movable upward or downward in the vapor generating chamber and to support a substrate on which an electronic device is mounted via a solder. The apparatus also includes at least one mesh plate extending in a horizontal direction in the vapor generating chamber. The at least one mesh plate includes a plurality of openings through which the vapor moves.