Transparent Mesh Wiring Board With Blackened Layer for Low Visibility

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Solution Overview

Problem

The challenge in developing smaller, thinner, and lighter portable terminal devices is the limited space for antennas, which reduces design flexibility and radio wave sensitivity due to the arrangement of multiple communication band antennas.

Innovation Solution

A wiring board with a mesh wiring layer that includes a metal layer covered by a blackened layer, made of palladium or tellurium, to enhance transparency and reduce visibility, while maintaining conductivity and radio wave sensitivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a mesh wiring layer is formed with a conductor layer to ensure conductivity and radio wave sensitivity, then the electrical function is improved, but the visibility to the naked eye increases making it readily visible

Engineering Contradiction:
Improveconductivity and radio wave sensitivityVSAvoidvisibility to the naked eye
Core Design Contradiction:
ReliabilityVSIllumination intensity

Solution Approach 1:

The patent applies a blackened layer on the conductor layer to change its optical appearance. The blackened layer has a thickness of 5 nm or more and 100 nm or less, which absorbs visible light and makes the mesh wiring layer not readily visible to the naked eye while maintaining electrical conductivity and radio wave sensitivity.

Inventive Principle:
Principle #32Color changes

Solution Approach 2:

The patent creates a composite structure consisting of a conductor layer and a blackened layer. The conductor layer provides electrical conductivity and radio wave sensitivity, while the blackened layer provides optical absorption to reduce visibility. This composite material approach resolves the contradiction between electrical function and aesthetic appearance.

Inventive Principle:
Principle #40Composite materials

2Illumination intensity

If the thickness of the blackened layer is increased to reduce visibility, then the aesthetic appearance is improved, but the electrical conductivity and radio wave sensitivity deteriorate

Engineering Contradiction:
Improvevisibility reductionVSAvoidelectrical conductivity and radio wave sensitivity
Core Design Contradiction:
Illumination intensityVSReliability

Solution Approach 1:

The patent optimizes the thickness parameter of the blackened layer to be 5 nm or more and 100 nm or less. This parameter range is carefully selected to achieve sufficient optical absorption (making the mesh not readily visible) while maintaining adequate electrical conductivity and radio wave sensitivity. The specific thickness range resolves the contradiction between aesthetic appearance and electrical function.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a transparent and conductive mesh wiring layer that is not readily visible to the naked eye, enhancing the design flexibility and radio wave sensitivity of portable devices.

Implementation Method 1

The blackened layer has a thickness of 5 nm or more and 100 nm or less, making the mesh wiring layer not readily visible to the naked eye

Methodology Applied
Scientific EffectLight absorption: Absorption (EM radiation)

Implementation Method 2

The blackened layer may be obtained by subjecting the metal layer to an oxidation process

Methodology Applied
Scientific EffectOxidation: Oxidation

Data Source

PatentUS12424752B2Wiring board and method for manufacturing wiring board
Publication Date: 2025.09.23 DAI NIPPON PRINTING CO LTD
  • US12424752B2 patent drawing
  • US12424752B2 patent drawing
  • US12424752B2 patent drawing

AI summary

A wiring board (10) includes a substrate (11) and a mesh wiring layer (20) disposed on the substrate (11) and including a plurality of wiring lines (21, 22). The substrate (11) has a transmittance of 85% or more for light with a wavelength of 380 nm or more and 750 nm or less. Each of the wiring lines (21, 22) includes a metal layer (27) and a blackened layer (28) disposed on the metal layer (27). The blackened layer (28) has a thickness (T2) of 5 nm or more and 100 nm or less.