Meshed Patch Antenna Arrays With Shared ICs for Lower Insertion Loss
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Solution Overview
Problem
Mobile computing devices with multiple antenna arrays face high insertion losses and increased costs due to the use of multiple phase array ICs and cables for 5G MM wave communication, which affect signal transmission efficiency and coverage.
Innovation Solution
Implementing a meshed patch structure for antenna arrays positioned directly on the main logic board, utilizing a shared IC to drive multiple antenna arrays without dedicated phase array ICs and cables, reducing RF interconnection components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple phase array ICs and cables are used to connect antenna arrays to the main logic board, then spatial coverage requirements can be met, but insertion losses increase and signal transmission efficiency deteriorates
Solution Approach 1:
The patent integrates multiple antenna arrays directly onto the main logic board, merging the antenna structures with the board itself. This eliminates the need for separate phase array ICs and cables, thereby reducing insertion losses while maintaining spatial coverage through multiple antenna elements facing different directions
Solution Approach 2:
The main logic board serves multiple functions: it acts as both the computational platform and the mounting substrate for multiple antenna arrays. The meshed patch structure on the board provides RF interconnection functionality without requiring dedicated RF cables, reducing signal loss while maintaining coverage
2Adaptability or versatility
If multiple dedicated phase array ICs and cables are used for each antenna array, then each array can be driven independently, but device complexity and production cost increase
Solution Approach 1:
Multiple antenna arrays are integrated directly on the main logic board with shared RF interconnections, merging what would traditionally be separate driven units into a single integrated structure. This reduces the number of ICs and cables while maintaining the ability to control different antenna arrays independently through software configuration
Solution Approach 2:
The main logic board's RF infrastructure serves multiple antenna arrays simultaneously, providing universal control capability. A single IC on the board can drive multiple antenna arrays by selectively activating different meshed patch structures, reducing component count while preserving adaptability
3Ease of manufacture
If antenna arrays are positioned on separate modules connected via cables, then modular assembly is easier, but signal loss increases and construction complexity increases
Solution Approach 1:
The antenna arrays are merged with the main logic board into a single integrated structure, eliminating the need for separate modular antenna modules and their connecting cables. This integration reduces RF interconnection components and signal loss while the meshed patch structure allows for standardized manufacturing processes
Data Source
AI summary
An example mobile computing device includes a main logic board (MLB); a first antenna array positioned on the MLB and configured to transmit signals in a first direction, the first antenna array comprising one or more planes; and a second antenna array positioned on the MLB and configured to transmit signals in a second direction, the second, direction being different than the first direction, the second antenna array comprising one or more planes and the second direction being different than the first direction, wherein at least one of the one or more of the planes in the first antenna array or at least one of the one or more of the pianos in the second antenna array comprises a meshed patch structure.