Mesogen Epoxy Composition for Thermal Conductivity and Fluidity
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Solution Overview
Problem
Conventional epoxy resins face challenges in thermal conductivity due to high melting points and viscosity, limiting their use in high-heat conduction modules and solvent-free packaging materials, and the addition of thermal conductive powder affects mechanical properties and fluidity.
Innovation Solution
An epoxy compound with a mesogen structure and aliphatic chain is introduced, allowing for π-π stacking and reducing melting point, resulting in a crystal-like structure with improved thermal conductivity and fluidity, suitable for solvent-free liquid packaging materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional epoxy resins with mesogen structures are used to improve thermal conductivity, then thermal conductivity is enhanced, but melting point increases (higher than 120°C) and viscosity in melting state increases, making them difficult to disperse evenly
Solution Approach 1:
The patent modifies the molecular structure parameters of epoxy resins by introducing specific aliphatic chain lengths and mesogen structures. By controlling the chain length (n=3-10) and mesogen positioning, the resin achieves optimal balance between thermal conductivity and processing properties, reducing melting point below 120°C while maintaining thermal performance
Solution Approach 2:
The invention creates composite epoxy resin systems by combining epoxy resins with specific mesogen structures and aliphatic chains. The composition includes epoxy resins (30-70 wt%), curing agents (20-40 wt%), and fillers (10-30 wt%), forming a composite material that achieves both high thermal conductivity and good fluidity for even dispersion
2Temperature
If a large amount of thermal conductive powder is added to conventional epoxy resin to improve thermal conductivity, then thermal conductivity increases, but fluidity deteriorates and mechanical properties are affected
Solution Approach 1:
The patent changes the base resin parameters by using epoxy resins with optimized molecular structures (specific chain lengths and mesogen configurations). This reduces the resin's inherent viscosity and melting point, allowing higher filler loads (up to 30 wt%) without severe fluidity loss, thereby maintaining both thermal conductivity and processability
3Temperature
If conventional epoxy resins with mesogen structures are used, then thermal conductivity is improved, but melting point increases (higher than 120°C), affecting stability and lifespan
Solution Approach 1:
The patent optimizes molecular parameters by controlling aliphatic chain length (n=3-10) and mesogen structure configuration. This achieves a critical balance point where melting point drops below 120°C, ensuring the resin remains stable and does not accelerate aging, while maintaining high thermal conductivity for improved device lifespan
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The epoxy compound achieves enhanced thermal conductivity and processability, enabling its use in semiconductor component packages without solvents, with a curing process at lower temperatures.
Implementation Method 1
Due to the introduction of the group with a mesogen structure into the side chain of the epoxy compound, an orderly arrangement of microstructures is achieved via the π-π stacking among the aromatic moieties when the epoxy compound reacts with a curing agent.
Implementation Method 2
The composition includes the epoxy compound of the disclosure and a curing agent, wherein the weight ratio of the epoxy compound to the curing agent is 1:9 to 9:1
Data Source
AI summary
An epoxy compound, composition and cured product thereof are provided. The epoxy compound has a structure represented by Formula (I) wherein R1 and R2 are each independently cyano group, isocyanate group, oxiranyl, methyloxiranyl group, glycidyl group, methylglycidyl group, epoxypropyl group, oxetanyl group, oxetanemethyl group, or C1-C10 alkoxy group; Z is —O—, R3 and R4 are each independently hydrogen, fluorine, methyl, fluoromethyl, or ethyl; n and m are each independently 3, 4, 5, 6, 7, 8, 9, or 10; and i and j are each independently 1, 2, or 3.