Mesogenic Dielectric Polymer for Low-CTE Passivation Layers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current polymers used in passivation layers for electronic devices face challenges such as high processing temperatures leading to warping, poor mechanical stability, and unsuitable thermal expansion properties, which affect the reliability and efficiency of microelectronic devices.
Innovation Solution
Development of a novel polymer with a specific polymerizable compound structure that includes a mesogenic group and polymerizable groups, allowing for the formation of a dielectric material with excellent film-forming capabilities, mechanical properties, and low thermal expansion, suitable for electronic packaging applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional polymers are used for passivation layers, then film formation is achieved, but mechanical deformation (warping) occurs due to high processing temperatures and undesirable thermal expansion
Solution Approach 1:
The patent modifies the thermal expansion parameters of the polymer by incorporating mesogenic groups into the polymer structure. This changes the coefficient of thermal expansion (CTE) to match that of silicon and other semiconductor substrates, thereby reducing thermal stress and warping during high-temperature processing while maintaining film formation capability
Solution Approach 2:
The patent creates a composite polymer material that combines conventional polymer chains with mesogenic groups (molecules with rigid rod-like structures). This composite structure provides both the film-forming properties of conventional polymers and the controlled thermal expansion characteristics of liquid crystalline materials, resolving the contradiction between mechanical stability and manufacturing precision
2Productivity
If high processing temperatures are used for polymerization, then complete polymerization is achieved, but thermal stress and warping increase
Solution Approach 1:
The patent changes the processing temperature parameters by utilizing the unique properties of mesogenic compounds that allow polymerization to proceed at lower temperatures. The mesogenic groups provide structural rigidity that enables complete polymerization at reduced temperatures, thereby achieving productivity without generating excessive thermal stress
3Ease of manufacture
If conventional polymers are used, then manufacturing is straightforward, but mechanical properties such as elongation at break and tensile strength are poor
Solution Approach 1:
The patent develops a composite polymer material incorporating mesogenic groups that maintain the ease of manufacture through standard coating and curing processes while dramatically improving mechanical properties. The rigid rod-like mesogenic structures reinforce the polymer matrix, enhancing tensile strength and elongation at break without complicating the manufacturing workflow
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The new polymer reduces the risk of mechanical deformation and thermal stress during manufacturing, leading to cost-effective and sustainable production of microelectronic devices with improved reliability and performance.
Implementation Method 1
The polymers are photostructurable and particularly suitable for various applications in electronic packaging
Implementation Method 2
Reactive mesogens (RMs), when polymerized at temperatures at which they exhibit thermotropic liquid crystal (LC) phases (typically nematic, cholesteric or smectic), give anisotropic polymers which conserve the liquid crystalline state
Data Source
AI summary
The present invention relates to a novel class of polymers which can be used as dielectric material for the preparation of passivation layers in electronic devices. The polymers are prepared from polymerizable compounds having mesogenic groups and they provide excellent film forming capability and excellent mechanical properties and have a low dielectric constant and a low coefficient of thermal expansion (CTE). There is further provided a method for forming said polymers and an electronic device containing said polymers as dielectric material. Beyond that, the present invention relates to a manufacturing method for preparing a packaged microelectronic structure and to a microelectronic device comprising said packaged microelectronic structure formed by said manufacturing method.