Mesogenic Epoxy Resin Composition for Thermal Conductivity
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Solution Overview
Problem
Mesogen-containing epoxy resins face issues with high viscosity and void formation when solvents are added, affecting handleability and thermal conductivity, and existing solutions do not adequately improve these properties.
Innovation Solution
A composition of epoxy resin comprising a first epoxy compound with a biphenyl structure and a second epoxy compound with a different mesogenic structure, at specific mass ratios, which decreases viscosity and enhances handleability while forming a smectic structure for improved thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a mesogen-containing epoxy resin is used to improve thermal conductivity, then thermal conductivity is improved, but viscosity increases and fluidity becomes insufficient
Solution Approach 1:
The patent modifies the molecular structure parameters of the epoxy compound by introducing specific mesogenic groups (biphenyl, terphenyl, or naphthalene structures) with controlled substitution patterns and alkylene chain lengths. This structural parameter optimization allows the resin to achieve good fluidity while maintaining thermal conductivity properties.
Solution Approach 2:
The patent creates a composite epoxy resin system by combining epoxy compounds with different mesogenic structures (biphenyl, terphenyl, or naphthalene) and different functionality (diglycidyl ether, triglycidyl ether, or tetraglycidyl ether). This composite approach balances fluidity and thermal conductivity through synergistic effects of multiple molecular structures.
2Ease of operation
If a solvent is added to reduce viscosity and improve fluidity, then fluidity is improved, but void formation occurs during curing affecting product quality
Solution Approach 1:
The patent extracts and eliminates the solvent component from the epoxy resin system. Instead of using solvent-based formulations, the invention develops solvent-free epoxy compounds with inherently good fluidity through molecular structure design, thereby avoiding void formation during curing while maintaining ease of operation.
Solution Approach 2:
The patent changes the molecular weight and structural parameters of the epoxy compound to achieve optimal fluidity without solvents. By controlling the alkylene chain length (1-10 carbon atoms) and mesogenic group structure, the resin achieves suitable viscosity and fluidity for processing while remaining solvent-free to prevent void formation.
3Temperature
If existing mesogen-containing epoxy resins are used, then thermal conductivity is improved, but handleability remains insufficient due to high viscosity
Solution Approach 1:
The patent optimizes multiple molecular parameters simultaneously: mesogenic group type (biphenyl, terphenyl, naphthalene), substitution position (2,3- or 3,3'-position), alkylene chain length (1-10 carbon atoms), and epoxy functionality (di-, tri-, or tetra-functional). This multi-parameter optimization achieves the best balance between thermal conductivity and handleability.
Solution Approach 2:
The patent formulates a composite epoxy system incorporating epoxy compounds with different functionalities and mesogenic structures. This composite formulation enhances both thermal conductivity and handleability through synergistic interactions between different molecular species, overcoming the limitations of single-structure epoxy resins.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed epoxy resin composition exhibits reduced viscosity and improved handleability, along with enhanced thermal conductivity and fracture toughness, minimizing void formation and achieving a smectic structure for superior performance.
Implementation Method 1
an epoxy compound having a mesogenic structure in a molecule... can form a smectic structure upon reaction with the hardener
Data Source
AI summary
An epoxy resin, comprising an epoxy compound having a mesogenic structure, the epoxy compound comprising a first epoxy compound having one biphenyl structure in a molecule and a second epoxy compound that is different from the first epoxy compound, at a mass ratio of the first epoxy compound to the second epoxy compound (first epoxy compound : second epoxy compound) of from 10:100 to 50:100.