Cured Epoxy Resin with Mesogenic Structure and Flexible Curing Agent
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Solution Overview
Problem
Cured epoxy resins exhibit lower fracture toughness compared to thermoplastic resins while compromising heat resistance when attempting to improve fracture toughness, necessitating a balance between these properties.
Innovation Solution
Incorporating an epoxy compound with a mesogenic structure and a curing agent having a molecular chain or flexible backbone with a molecular weight of 100 or more, which can form a smectic or non-smectic structure, to enhance fracture toughness and maintain heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a substance that improves fracture toughness is added to epoxy resin, then fracture toughness is improved, but production efficiency is reduced due to the adding process
Solution Approach 1:
The patent combines the fracture toughness improvement function and the curing agent function into a single substance. The curing agent itself possesses fracture toughness improvement capability through its molecular chain or flexible backbone structure, eliminating the need for separate additive steps and merging two functions into one material component.
Solution Approach 2:
The curing agent is designed to serve multiple functions simultaneously: it cures the epoxy resin while also acting as a fracture toughness improvement agent. This multi-functionality is achieved by selecting curing agents with specific molecular structures (molecular weight ≥100, containing molecular chains or flexible backbones) that provide both curing capability and enhanced mechanical properties.
2Strength
If a substance that improves fracture toughness is added to epoxy resin, then fracture toughness is improved, but other properties of cured epoxy resin may deteriorate
Solution Approach 1:
The patent changes the parameters of the curing agent itself rather than adding separate substances. By selecting curing agents with specific parameters (molecular weight ≥100, presence of molecular chains or flexible backbones), the patent achieves fracture toughness improvement while maintaining control over other cured epoxy resin properties through systematic parameter selection.
Solution Approach 2:
The patent creates a composite curing system where the curing agent combines multiple functional characteristics within its molecular structure. The curing agent acts as a composite material at the molecular level, integrating both the curing function and the fracture toughness enhancement function into a single unified substance.
3Strength
If fracture toughness of cured epoxy resin is improved, then fracture toughness increases, but glass transition temperature generally decreases
Solution Approach 1:
The patent systematically changes the parameters of the curing agent (molecular weight, molecular chain structure, flexible backbone content) to achieve an optimal balance between fracture toughness and glass transition temperature. By carefully selecting and adjusting these parameters, the patent finds a sweet spot where both properties are simultaneously improved or maintained at acceptable levels.
Solution Approach 2:
The patent employs a composite approach by using curing agents that combine rigid structural elements (for maintaining heat resistance) with flexible components (molecular chains, flexible backbones for improving fracture toughness). This molecular-level composite structure allows simultaneous optimization of both fracture toughness and glass transition temperature.
Data Source
AI summary
A cured epoxy resin, which is a cured product of an epoxy compound having a mesogenic structure and a curing agent having a molecular chain or a flexible backbone with a molecular weight of 100 or more, the cured epoxy resin having a smectic structure; a cured epoxy resin, which is a cured product of an epoxy compound having a mesogenic structure and a curing agent having a molecular chain or a flexible backbone with a molecular weight of 100 or more, the cured epoxy resin not having a smectic structure; an epoxy resin composition, comprising an epoxy compound having a mesogenic structure and a curing agent having a molecular chain with a molecular weight of 100 or more; and an epoxy resin composition, comprising an epoxy compound having a mesogenic structure and a curing agent having a flexible backbone with a molecular weight of 100 or more.