Mesogenic Epoxy Compound for High-Conductivity Semiconductor Packaging
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Solution Overview
Problem
Conventional epoxy molding compounds for semiconductor packages face limitations in thermal conductivity, mechanical properties, and filler content, making it challenging to achieve high thermal conductivity while minimizing the amount of inorganic filler.
Innovation Solution
The development of a high-thermal conductive epoxy compound with a specific molecular structure, incorporating mesogenic units and a spacer to enhance π-π stacking and phonon vibration transfer, which increases thermal conductivity without requiring excessive filler content.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If relatively large amounts of high-thermal conductive inorganic filler are added to epoxy molding compound, then thermal conductivity is improved, but mechanical properties deteriorate and device complexity increases
Solution Approach 1:
The patent changes the chemical composition parameters of the epoxy resin by introducing mesogenic units with specific structural formulas (Formula 1 and Formula 2) containing rigid aromatic rings and flexible aliphatic chains. This molecular structure modification enables the resin itself to achieve high thermal conductivity (2.0-5.0 W/mK) without relying on excessive filler content, thereby maintaining mechanical properties while improving thermal performance.
Solution Approach 2:
The patent creates a composite system combining specially designed epoxy resin with mesogenic units, curing agents, and controlled filler content (30-70 wt%). The synergistic interaction between the mesogenic resin matrix and inorganic fillers achieves optimal thermal conductivity while preserving mechanical strength, adhesion, and flexibility.
2Temperature
If relatively large amounts of high-thermal conductive inorganic filler are added to epoxy molding compound, then thermal conductivity is improved, but the complexity of the composition increases
Solution Approach 1:
The patent modifies the resin's intrinsic thermal conductivity parameter through molecular design, reducing the dependency on filler content. This parameter change in the base resin allows for simplified composition with lower filler loading (30-70 wt% instead of higher amounts), thereby reducing composition complexity while achieving the same thermal conductivity target.
3Temperature
If filler loading content is increased to achieve high thermal conductivity, then thermal conductivity is improved, but mechanical properties and processability deteriorate
Solution Approach 1:
The patent changes the viscosity and flow characteristics parameters of the molding compound by designing epoxy resin with balanced molecular weight and mesogenic structure. This enables good processability (filling, molding, and curing) with reduced filler content, as the optimized resin matrix provides adequate lubrication and flow without requiring excessive filler loading for thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The epoxy compound achieves thermal conductivities up to 20 W/mK, providing effective heat radiation characteristics and improved mechanical properties, suitable for semiconductor packages with reduced filler usage.
Implementation Method 1
incorporating mesogenic units and a spacer to enhance π-π stacking and phonon vibration transfer, which increases thermal conductivity
Implementation Method 2
enhance π-π stacking and phonon vibration transfer
Data Source
AI summary
A high-thermal conductive epoxy compound and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package including the epoxy compound. The epoxy compound has a structure represented by Formula 1.E1-M1p-L1x-M2q-L2y-M3r-L3z-A-L3z-M3r-L2y-M2q-L1x-M1p-E2 Formula 1In Formula 1, M1, M2, M3, L1, L2, L3, A, E, p, q, r, x, y, and z are the same as defined in the detailed description.