Mesogenic Epoxy Compound for High-Thermal-Conductivity Packaging
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Solution Overview
Problem
Existing epoxy molding compounds (EMCs) used in semiconductor packages exhibit insignificant increases in thermal conductivity despite the addition of high-thermal-conductivity inorganic fillers, limiting their effectiveness in managing heat generated by complex and high-density semiconductor circuits.
Innovation Solution
Incorporation of epoxy compounds with a novel structure featuring aromatic rings and mesogenic units that enhance thermal conductivity through π-π stacking and intermolecular hydrogen bonding, along with spacers to form a liquid crystal-like structure, thereby improving phonon transfer pathways and reducing scattering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If high-thermal-conductivity inorganic fillers are added to epoxy molding compound, then thermal conductivity is expected to increase, but the increase is insignificant and thermal conductivity converges around 5 W/mK
Solution Approach 1:
The patent changes the chemical structure parameters of the epoxy resin itself by introducing mesogenic units with aromatic rings and specific spacer groups. This structural modification enables liquid crystal-like ordering and π-π stacking, fundamentally altering the thermal transport mechanism from filler-dependent to resin-intrinsic, achieving thermal conductivity of 18 W/mK or higher
Solution Approach 2:
The patent creates a composite structure at the molecular level by incorporating mesogenic units into the epoxy resin chain, forming a liquid crystal-like composite phase within the polymer matrix. This internal composite structure provides phonon transfer pathways that significantly enhance thermal conductivity without relying on external inorganic fillers
2Temperature
If conventional epoxy molding compounds are used, then processing is simpler, but thermal conductivity remains insufficient for high-density semiconductor circuits
Solution Approach 1:
The patent modifies the epoxy resin's molecular parameters by incorporating mesogenic units and spacer groups, creating a liquid crystal-like structure that inherently provides high thermal conductivity. This chemical parameter change enables the resin to achieve 18 W/mK or higher thermal conductivity while maintaining standard molding compound processing characteristics
3Temperature
If inorganic fillers are added to improve thermal conductivity, then heat dissipation is enhanced, but the complexity of the molding compound increases
Solution Approach 1:
The patent extracts the thermal conductivity enhancement function from the inorganic filler domain and transfers it to the organic resin domain. By incorporating mesogenic units directly into the epoxy resin structure, the patent eliminates the need for complex filler additions, achieving high thermal conductivity through the resin's intrinsic molecular structure
Solution Approach 2:
The patent changes the fundamental chemical parameters of the epoxy resin by introducing mesogenic units with aromatic rings and spacer groups. This parameter change creates liquid crystal-like ordering and π-π stacking pathways, enabling the resin to achieve 18 W/mK or higher thermal conductivity without requiring additional inorganic filler components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly increases the thermal conductivity of the epoxy compounds and their cured products, achieving up to 18 W/mK, compared to conventional EMCs that typically converge at around 5 W/mK, while maintaining a lower melting temperature and preventing thermal deformation during curing.
Implementation Method 1
enhance thermal conductivity through π-π stacking and intermolecular hydrogen bonding
Implementation Method 2
enhance thermal conductivity through π-π stacking and intermolecular hydrogen bonding
Implementation Method 3
improving phonon transfer pathways and reducing scattering
Implementation Method 4
form a liquid crystal-like structure, thereby improving phonon transfer pathways and reducing scattering
Data Source
AI summary
An epoxy compound having an aromatic ring represented by Formula 1 or Formula 2, a composition prepared from the epoxy compound, a semiconductor device prepared from the epoxy compound, an electronic device prepared from the epoxy compound, an article prepared from the epoxy compound, and a method of preparing the epoxy compound:E1-(M1)a1-(L1)b1-(M2)a2-L2-A1-L3-(M3)a3-(L4)b2-(M4)a4-E2 Formula 1E3-(A2)c1-(L5)b3-(M5)a5-L6-(M6)a6-L7-(M7)a7-(L8)b4-(A3)c2-E4 Formula 2In Formulae 1 and 2, M1, M2, M3, M4, M5, M6, M7, A1, A2, A3, L1, L2, L3, L4, L5, L6, L7, L8, E1, E2, E3, E4, a1, a2, a3, a4, a5, a6, a7, b1, b2, b3, b4, c1, and c2 are the same as defined in the detailed description.