Mesogenic Siloxane Epoxy Resin for Heat Dissipation and Low Warpage
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Solution Overview
Problem
Electronic component devices face challenges with heat dissipation due to low heat conductivity of cured thermosetting resin products, and warping caused by thermal stress leads to detachment issues, necessitating a material with high heat conductivity and low elasticity.
Innovation Solution
An epoxy resin with a mesogenic structure and siloxane structure is developed, combining both to enhance heat conductivity while maintaining low elasticity, achieved by incorporating a mesogenic structure that facilitates liquid crystallinity and a siloxane structure with low elasticity, which are integrated into a single molecule to improve compatibility and performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cured product of a thermosetting resin is used for heat dissipation, then electric insulation is improved, but heat conductivity deteriorates
Solution Approach 1:
The invention uses a composite material system combining epoxy resin with mesogenic groups and siloxane bonds. The mesogenic groups (aromatic rings) provide electric insulation and structural stability, while the siloxane bonds (-Si-O-) provide low elasticity and flexibility. This composite molecular structure achieves both high electric insulation and improved heat conductivity properties.
Solution Approach 2:
The invention changes the molecular structure parameters by incorporating specific mesogenic groups and siloxane bonds into the epoxy resin. By adjusting the molecular architecture to include these functional groups, the material achieves enhanced heat conductivity while maintaining the necessary electric insulation properties for electronic component applications.
2Reliability
If the elasticity of a cured product is decreased to suppress detachment, then reliability is improved, but heat conductivity deteriorates
Solution Approach 1:
The molecular composite combines mesogenic groups for structural integrity with siloxane bonds for flexibility. The siloxane bonds specifically provide low elasticity that suppresses detachment due to thermal stress, while the overall molecular structure maintains heat conductivity through the organized mesogenic arrangements.
Solution Approach 2:
The invention applies local quality by positioning siloxane bonds at specific locations within the molecular structure to provide flexibility and detachment resistance, while mesogenic groups are arranged to maintain heat conduction pathways. This localized functional distribution allows simultaneous achievement of low elasticity and high heat conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting epoxy resin composition exhibits superior heat conductivity and low elasticity, effectively addressing heat dissipation and warping issues in electronic components, ensuring reliable performance and reduced detachment risks.
Implementation Method 1
a cured product of an epoxy resin composition having a mesogenic structure in the molecular structure has been proposed
Implementation Method 2
capable of achieving a low elasticity
Data Source
Figure 1~2
AI summary
An epoxy resin has a mesogenic structure and a siloxane structure. An epoxy resin composition includes the epoxy resin having the mesogenic structure and the siloxane structure, and a curing agent.