Metal Bar Compartment Shielding for Flexible Semiconductor EMI Layouts
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Solution Overview
Problem
Existing compartment shielding methods for semiconductor devices, such as pre-formed cans, require additional machinery and are costly due to the need for different designs for various sizes and configurations, leading to decreased productivity and increased manufacturing complexity.
Innovation Solution
Forming compartment shielding using individual metal bars through a process involving a base film, mask layer, and conductive layer deposition, allowing for flexible layout and easier integration with standard surface mount technology processes, enabling thinner bars and varied shapes for improved shielding without the need for multiple can designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If pre-formed cans are used for compartment shielding, then electromagnetic interference protection is provided, but manufacturing complexity increases and productivity decreases due to additional machinery requirements
Solution Approach 1:
The patent segments the continuous conductive shielding can into discrete conductive bars that can be independently placed using standard surface mount technology. This segmentation allows the shielding function to be integrated into existing manufacturing lines without requiring specialized can-mounting machinery, thereby reducing manufacturing complexity while maintaining EMI protection.
Solution Approach 2:
The conductive bars serve multiple functions: they provide electromagnetic interference shielding, act as structural support elements, and can be placed using existing surface mount equipment. This multi-functionality eliminates the need for dedicated can-mounting machinery and reduces overall device complexity.
2Object-affected harmful factors
If pre-formed cans are used for compartment shielding, then electromagnetic interference protection is provided, but productivity decreases due to additional machinery and process steps
Solution Approach 1:
The patent merges the shielding function with the existing surface mount technology process. Conductive bars are placed alongside other surface mount components using the same equipment and process flow, eliminating separate can-mounting steps and integrating shielding into the standard manufacturing sequence, thereby improving productivity.
Solution Approach 2:
The conductive bars are prepared in advance as discrete components that can be directly fed into the surface mount equipment. This preliminary preparation allows the bars to be placed during the normal component mounting process without requiring additional setup or specialized equipment, thus maintaining high productivity.
3Object-affected harmful factors
If different can designs are used for various sizes and configurations, then proper shielding is achieved, but manufacturing costs increase
Solution Approach 1:
The patent uses a universal conductive bar design that can be configured in various arrangements to shield different device sizes and configurations. Instead of manufacturing custom cans for each application, the same basic bar component is used across multiple product lines, significantly reducing tooling and manufacturing costs while maintaining shielding effectiveness.
Solution Approach 2:
By segmenting the shielding into individual bars, the system gains flexibility to adapt to different device layouts without requiring custom-formed cans. The bars can be selectively placed and configured to match various package sizes and component arrangements, eliminating the need for expensive custom can designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces costs, and allows for flexible shielding configurations, enhancing the effectiveness of electromagnetic interference protection while maintaining compatibility with existing equipment and workflows.
Implementation Method 1
a conductive layer is formed over the mask layer... The conductive layer is formed to substantially fill the openings
Data Source
AI summary
A semiconductor device has a substrate and first and second electrical component disposed over the substrate. A first metal bar is disposed over the substrate between the first electrical component and second electrical component. The first metal bar is formed by disposing a mask over a carrier. An opening is formed in the mask and a metal layer is sputtered over the mask. The mask is removed to leave the metal layer within the opening as the first metal bar. The first metal bar can be stored in a tape-and-reel.