Metal Base Copper Clad Laminate Heat Sink Integration
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Solution Overview
Problem
Traditional methods for heat dissipation in driving power supplies, such as using heat sinks, are inefficient and prone to human error, leading to potential damage and low production efficiency.
Innovation Solution
A circuit board with a metal base copper clad laminate, comprising an aluminum or copper base layer, insulating layer, and copper foil layer, where the metal base is grounded through a weldable rivet connection, functions as both a heat sink and a grounded substrate, enabling automated assembly and improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink is installed on the power device, then heat dissipation is improved, but the production process becomes complex and prone to human error
Solution Approach 1:
The patent combines the heat dissipation function and the circuit board function into a single integrated structure. The metal base copper clad laminate serves both as the circuit board substrate and as the heat dissipation component, eliminating the need for separate heat sinks and reducing assembly complexity
Solution Approach 2:
The metal base copper clad laminate performs multiple functions simultaneously: it serves as the circuit board substrate, provides heat dissipation for power devices, and acts as a grounding structure. This multi-functionality reduces the number of components and simplifies the overall assembly process
2Temperature
If manual assembly is used to install heat sinks, then heat dissipation can be achieved, but production efficiency decreases and quality risks increase
Solution Approach 1:
By integrating the heat dissipation function into the circuit board itself, the patent eliminates the separate heat sink installation step. Power devices can be directly mounted on the metal base copper clad laminate using automated SMT equipment, significantly improving production efficiency and reducing quality risks
Solution Approach 2:
The patent replaces manual mechanical assembly of heat sinks with automated SMT mounting processes. The power devices are mounted directly on the metal base copper clad laminate using automated pick-and-place machines and reflow soldering, eliminating manual intervention and improving both efficiency and quality consistency
3Volume of moving object
If the circuit board bottom surface is close to the housing wall, then the structure is compact, but heat dissipation performance deteriorates
Solution Approach 1:
The patent merges the heat dissipation function with the circuit board structure itself. The metal base copper clad laminate provides thermal pathways within the board, allowing effective heat dissipation even when the board is positioned close to the housing wall, thus maintaining compactness without sacrificing heat dissipation performance
Solution Approach 2:
The metal base copper clad laminate acts as a thermal intermediary, providing internal heat dissipation pathways within the circuit board structure. This allows heat to be conducted away from power devices through the metal base layer without requiring external heat sinks or large spacing from the housing wall
4Temperature
If traditional heat sink methods are used, then heat dissipation is attempted, but EMC problems arise due to improper grounding
Solution Approach 1:
The patent combines the grounding function with the heat dissipation structure. The metal base copper clad laminate serves as both the heat dissipation path and the grounding structure, ensuring proper electrical connection and eliminating EMC issues that arise from improper grounding in traditional heat sink configurations
Solution Approach 2:
The metal base copper clad laminate performs multiple functions including heat dissipation, structural support, and grounding. By integrating the grounding function into the same structure that provides heat dissipation, the patent ensures proper electrical connectivity and eliminates EMC problems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances production efficiency, reduces quality risks, and addresses electromagnetic compatibility (EMC) issues by automating the mounting of power devices on a metal substrate that acts as a heat sink, while ensuring proper grounding.
Implementation Method 1
the copper base layer is welded to a ground contact of the main board
Implementation Method 2
the metal substrate can realize the function of the heat sink
Implementation Method 3
the copper foil layer is directly or indirectly connected to the main board
Data Source
AI summary
A circuit board has a main board with a base material of insulating material, at least one metal base copper clad laminate, and each metal base copper clad laminate is provided with at least one component and a pin connected with the main board. The circuit board and the driving power supply with the circuit board have simple structure and low manufacturing cost, and are convenient for automatic manufacturing. The power device can be directly mounted on the metal substrate through the automation equipment, so that the metal substrate can realize the function of the heat sink, thereby improving the production efficiency and reducing the process quality hidden danger; at the same time, the grounding problem of the metal substrate is solved, and the EMC problem is avoided.