Metal-Base Drive Circuit Substrate for Inkjet Heat Dissipation
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Solution Overview
Problem
Ink jet printers with increasing numbers of nozzles face heat generation issues in drive circuits, leading to component deterioration and malfunction due to inefficient heat release.
Innovation Solution
A liquid ejecting apparatus with a drive circuit substrate that includes a metal-based base material thicker than the propagation wire layer, facilitating efficient heat dissipation through the substrate's thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of nozzles in the print head is increased to improve print quality and printing speed, then productivity is improved, but heat generation in the drive circuit increases leading to component deterioration and malfunction
Solution Approach 1:
The patent extracts the heat dissipation function from the conventional substrate structure by introducing a dedicated heat dissipation layer made of metal material. This layer is specifically designed to extract heat from the drive circuit components, separating the heat management function from the structural support function of the substrate.
Solution Approach 2:
The patent introduces a heat dissipation layer as an intermediary between the drive circuit and the external environment. This intermediate layer facilitates efficient heat transfer from the heat-generating components to the surroundings, acting as a thermal conduit that protects the drive circuit from overheating.
2Productivity
If the number of nozzles in the print head is increased to improve print quality and printing speed, then productivity is improved, but heat generation in the drive circuit increases
Solution Approach 1:
The patent applies local quality by making the heat dissipation layer have different thermal conductivity properties in different regions. The layer is configured with higher thermal conductivity directly beneath the drive circuit components to maximize heat extraction at the heat-generating locations, while other regions may have different properties optimized for their specific functions.
Solution Approach 2:
The patent extracts the heat management function from the overall substrate design by incorporating a specialized heat dissipation layer. This dedicated layer is responsible for thermal management, allowing the rest of the substrate to focus on structural and electrical functions.
3Ease of manufacture
If conventional substrate materials are used, then ease of manufacture is maintained, but heat dissipation efficiency is insufficient leading to component deterioration
Solution Approach 1:
The patent employs composite materials by combining conventional substrate materials with a metal-based heat dissipation layer. This composite structure leverages the manufacturing advantages of conventional materials while adding the superior thermal conductivity of metals to improve heat dissipation efficiency and component reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the risk of component deterioration and malfunction by efficiently releasing heat generated in the drive circuit, improving the apparatus's reliability and performance.
Implementation Method 1
a metal base material thicker than a thickness of the first layer laminated on a first face of the base material, thereby effectively releasing heat generated in the drive circuit
Data Source
AI summary
A liquid ejecting apparatus includes a drive element, and a drive circuit that outputs a drive signal that drives the drive element, wherein the drive circuit includes a modulation circuit that modulates a base drive signal to output a modulation signal, an amplifier circuit that amplifies the modulation signal to output an amplified modulation signal, a demodulation circuit that demodulates the amplified modulation signal to output the drive signal, and a substrate on which the modulation circuit, the amplifier circuit, and the demodulation circuit are provided, wherein the substrate includes a base material includes a metal and a first layer laminated on the base material, wherein the first layer includes a first propagation wire through which at least one of the amplified modulation signal and the drive signal propagates, and wherein the base material has a thickness greater than a thickness of the first layer.