Metal Base Stacking Package for Heat Dissipation and Shielding
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Solution Overview
Problem
Conventional multichip package structures fail to effectively dissipate heat and provide electromagnetic shielding, leading to reduced chip stability and lifespan.
Innovation Solution
A metal top stacking package structure is introduced, featuring a metal base with a die receiver cavity, adhesion layers, electrically connecting wires, and a heat sink, along with a metal layer on the substrate for enhanced heat dissipation and electromagnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional multichip package structure with stacked chips is used, then the density of electronic components is enhanced and electrical connecting channels are shortened, but heat dissipation and electromagnetic shielding are insufficient leading to reduced chip stability and lifespan
Solution Approach 1:
The patent employs a composite structure combining metal base material with ceramic or plastic encapsulation material. The metal base provides superior thermal conductivity for heat dissipation and electromagnetic shielding properties, while the ceramic or plastic encapsulation provides structural support and environmental protection. This composite approach resolves the contradiction by integrating materials with complementary properties to simultaneously achieve high component density and reliable heat dissipation.
Solution Approach 2:
The metal base in the patent serves multiple functions simultaneously: it acts as a structural support foundation, a heat dissipation pathway through its thermal conductivity, and an electromagnetic shield through its metallic properties. By making the metal base multi-functional, the design achieves improved chip stability and lifespan without compromising component density, effectively resolving the technical contradiction.
2Volume of moving object
If chips are stacked vertically in conventional multichip package structure, then the overall size is reduced, but heat energy cannot effectively dissipate from the package
Solution Approach 1:
The metal base acts as an intermediary thermal management component between the stacked chips and the external environment. It provides dedicated thermal pathways through its high thermal conductivity, mediating the heat transfer from multiple chips simultaneously. This allows the package to maintain compact vertical stacking while effectively dissipating heat through the metal base's thermal management capabilities.
3Temperature
If conventional heat sink structure is used between chips, then some heat dissipation is achieved, but electromagnetic shielding effect is insufficient
Solution Approach 1:
The patent replaces conventional non-metallic heat sink materials with a metal base that possesses both thermal conductivity for heat dissipation and electromagnetic shielding properties. This material substitution resolves the contradiction by selecting a material that simultaneously addresses both heat management and electromagnetic interference protection requirements.
Solution Approach 2:
The metal base structure performs dual functions of heat dissipation and electromagnetic shielding simultaneously. By designing the metal base with appropriate thickness and conductivity, it provides thermal pathways for heat removal while also forming an effective electromagnetic shield, eliminating the need for separate shielding components and resolving the trade-off between heat dissipation and electromagnetic protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves heat dissipation and electromagnetic shielding, thereby enhancing the stability and lifespan of semiconductor chips by using a metal base and heat sink for efficient heat transfer and a metal layer for magnetic field interference reduction.
Implementation Method 1
The heat energy during the working chips cannot effectively dissipate from the package, thereby reducing the chip stability and life time
Implementation Method 2
the heat sink between the first chip and the second chip cannot achieve the ideal effect in heat dissipation and electromagnetic shielding
Data Source
AI summary
A meal top stacking package structure and a method for manufacturing the same are provided, wherein the metal top stacking package structure includes a metal base including an upper surface and a lower surface, and a die receiver cavity formed in the upper surface; a first chip fixed on the die receiver cavity by a first adhesion layer; a substrate with an upper surface; a second chip fixed on the upper surface of the substrate by a second adhesion layer; and a plurality of connecting components formed on the upper surface of the substrate; wherein the upper surface of the metal base is connected with the substrate by the connecting components. Thereby, the structure and method can enhance heat dissipation and electromagnetic shield of the stacking package structure.