Metal-Base Substrate With Through Holes for Bubble Removal
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Solution Overview
Problem
High mounting density applications for light emitting elements require effective heat dissipation, but existing metal-base substrates face challenges in removing bubbles formed during manufacturing, which can affect the quality and heat dissipation characteristics of circuit boards.
Innovation Solution
A metal-base substrate design incorporating a film substrate with a wiring layer, adhesive layers, and a metal plate, featuring through holes that facilitate the removal of bubbles during the manufacturing process, ensuring improved heat dissipation and electrical characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal-base substrate is used for high heat dissipation applications, then heat dissipation characteristics are improved, but bubbles formed during manufacturing cannot be effectively removed
Solution Approach 1:
The patent introduces through-holes (porous structures) in the film substrate to enable bubble escape paths. These through-holes allow bubbles formed during manufacturing to be discharged from the metal-base substrate, solving the problem of bubble entrapment while maintaining the heat dissipation function of the metal plate.
2Productivity
If high mounting density is used for light emitting elements, then productivity is improved, but heat dissipation requirements become more stringent
Solution Approach 1:
The patent segments the substrate into distinct functional layers: a metal plate for heat dissipation, a film substrate for insulation and structural support, and adhesive layers for bonding. This segmentation allows each layer to optimize its function, with the metal plate providing enhanced heat dissipation capability to support high mounting density applications.
3Reliability
If a film substrate with adhesive layer is used, then electrical insulation is improved, but bubble discharge capability deteriorates
Solution Approach 1:
The film substrate is designed to serve multiple functions simultaneously: it provides electrical insulation between the metal plate and wiring layers, structural support for the laminate, and contains through-holes that enable bubble discharge. This multi-functionality resolves the contradiction between maintaining insulation properties and enabling bubble removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate design enhances heat dissipation and reduces bubble formation, resulting in improved quality and performance of light emitting devices with high heat dissipation characteristics.
Implementation Method 1
a metal plate 16
Implementation Method 2
an adhesive layer 15 for a metal plate 16
Data Source
AI summary
A metal-base substrate includes a metal plate, an adhesive layer; and a film substrate. The adhesive layer is interposed between the metal plate and the film substrate. The film substrate has a wiring layer on a first surface opposite to a second surface on which the adhesive layer is arranged, with a through hole piercing through the film substrate in a thickness direction of the film substrate.