Metal Circuit Board Layout for Compact Image Display Cooling
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Solution Overview
Problem
Existing image display devices face challenges in downsizing due to the requirement of space for installing the heat dissipator, which limits their miniaturization.
Innovation Solution
The image display device incorporates a metal circuit board with a stacked plate-shaped metal member where light-emitting elements are mounted, featuring a disposition region and a non-disposition region positioned higher in the vertical direction, allowing efficient heat dissipation without additional heat dissipation fins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipator is installed to dissipate heat, then heat dissipation is improved, but device size increases
Solution Approach 1:
The patent combines the heat dissipation function with the circuit board structure by forming heat dissipation protrusions directly on the circuit board. This integration eliminates the need for separate heat dissipators, achieving effective heat dissipation while maintaining compact device dimensions.
Solution Approach 2:
The patent utilizes the thickness direction (vertical dimension) of the circuit board to create heat dissipation protrusions. By extending heat dissipation structures in the thickness direction rather than requiring additional planar space, the design achieves effective heat dissipation without increasing the device's footprint area.
2Temperature
If additional heat dissipation components are added, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The heat dissipation function is merged into the circuit board itself through integrated heat dissipation protrusions. This eliminates the need for separate heat dissipation components and their associated mounting structures, thereby reducing device complexity while maintaining effective heat dissipation.
Solution Approach 2:
The circuit board is designed to serve multiple functions: electrical connection, structural support, and heat dissipation. The heat dissipation protrusions are formed as integral parts of the circuit board, allowing the same component to perform both signal transmission and thermal management functions simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation efficiency, enabling the device to be miniaturized by eliminating the need for additional heat dissipation components, thus reducing its overall size.
Implementation Method 1
the metal circuit board has a disposition region where the light-emitting element is disposed and a non-disposition region where the light-emitting element is not disposed
Implementation Method 2
a reflective optical unit configured to reflect the display light and project the display light to a display member
Data Source
AI summary
An image display device includes a display unit that emits display light and a reflective optical unit that reflects the display light and projects the display light to a display member. The display unit includes a metal circuit board on which a light-emitting element is mounted by stacking a plate-shaped metal member in a thickness direction, and a display that receives light emitted from the light-emitting element and emits the display light. The metal circuit board has a disposition region where the light-emitting element is disposed and a non-disposition region where the light-emitting element is not disposed. The non-disposition region is provided at a position higher than the disposition region in a vertical direction.