Metal Bottom Camera Module Driving Module Flatness
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Solution Overview
Problem
Conventional camera module driving modules face challenges with volume reduction, flatness maintenance, alignment errors, and assembly efficiency due to the use of plastic bottoms and flexible printed circuit boards, which restricts the miniaturization and increases assembly time.
Innovation Solution
A camera module design featuring a metal bottom with a first and second insulation layer and conductive layers, where the conductive layers are patterned using molded interconnect devices and thermoplastic, allowing for a more compact and stable electromagnetic driving assembly that reduces the module's height and enhances flatness, with improved thermal dissipation and assembly efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a plastic bottom is used to retain the flatness of the flexible printed circuit board, then the flatness is maintained, but the volume of the driving module cannot be reduced
Solution Approach 1:
The patent changes the material parameter of the bottom from plastic to metal, which fundamentally alters the physical properties. The metal bottom provides inherent rigidity and flatness without requiring the thickness constraints that plastic materials impose, thereby enabling volume reduction while maintaining manufacturing precision
Solution Approach 2:
The patent employs a composite structure consisting of a metal bottom with insulation layers and conductive layers integrated into it. This composite design combines the rigidity and flatness of metal with the electrical insulation and conductivity requirements, eliminating the need for separate plastic bottoms and flexible printed circuit boards
2Reliability
If a flexible printed circuit board is used to connect external circuits to inner electronic members, then electrical connection is achieved, but alignment errors occur during joining and yield is reduced
Solution Approach 1:
The patent merges the functions of the flexible printed circuit board, insulation layers, and bottom structure into a single integrated metal bottom assembly. The conductive layers are directly formed on the metal bottom through molding processes, eliminating separate joining operations and ensuring precise alignment between electrical connections and mechanical structures
Solution Approach 2:
The insulation layers and conductive layers are pre-formed on the metal bottom during the bottom manufacturing process itself, rather than being added separately during assembly. This preliminary action ensures precise alignment and eliminates subsequent joining operations that would otherwise cause alignment errors
3Productivity
If the joining process is used to connect the flexible circuit board to the bottom, then electrical connection is established, but the process takes a lot of time and capacity improvement is difficult
Solution Approach 1:
The patent combines multiple manufacturing steps into a single integrated process. The insulation layers and conductive layers are formed on the metal bottom in one continuous manufacturing sequence, eliminating the need for separate joining operations between flexible circuit boards and bottoms, thereby dramatically reducing assembly time and increasing production capacity
Solution Approach 2:
The patent extracts and eliminates the flexible printed circuit board component entirely from the assembly process. By integrating all electrical connection functions directly into the metal bottom structure, the time-consuming joining process is removed from the manufacturing workflow
4Temperature
If a metal bottom is used to reduce volume and improve heat dissipation, then thermal conductivity is enhanced, but the thickness must be optimized to maintain flatness
Solution Approach 1:
The patent uses a composite structure with multiple layers (metal bottom, insulation layers, conductive layers) where each layer contributes specific properties. The metal bottom provides thermal conductivity, while the insulation and conductive layers maintain the overall flatness and provide electrical functions, allowing thin metal thickness without sacrificing flatness
Solution Approach 2:
The patent changes the thickness parameter of the metal bottom to an optimized range (0.10-0.35 mm) that balances thermal conductivity with structural rigidity. This parameter optimization, combined with the supporting insulation layers, enables effective heat dissipation while maintaining the flatness required for optical component alignment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a more compact, reliable, and efficient camera module with reduced electromagnetic interference, improved heat dissipation, and enhanced assembly yield by using a metal bottom with strategically arranged conductive and insulation layers, addressing the limitations of conventional plastic-based designs.
Implementation Method 1
an electromagnetic driving assembly, and a lens assembly. The bottom includes a metal member, a first insulation layer formed on the metal member, and a first conductive layer formed on the first insulation layer. The first conductive layer is electrically connected to the electromagnetic driving assembly. The electromagnetic driving assembly can drive the lens assembly to move relative to the bottom.
Implementation Method 2
The solution reduces the camera module's volume, improves flatness and assembly efficiency, enhances thermal conductivity, and increases reliability by using a metal bottom with aligned thermal expansion coefficients, thereby improving the alignment and connection strength of components.
Data Source
AI summary
A camera module is provided, including a bottom, an electromagnetic driving assembly, and a lens assembly. The bottom includes a metal member, a first insulation layer formed on the metal member, and a first conductive layer formed on the first insulation layer. The first conductive layer is electrically connected to the electromagnetic driving assembly. The electromagnetic driving assembly can drive the lens assembly to move relative to the bottom.