Metal Bump Concave Surface Enhances Substrate Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The semiconductor industry faces challenges with weight reduction and miniaturization, including low yield during manufacturing of fine pitch conductive traces, handling difficulties with thin semiconductor substrates, high costs associated with underfill in flip-chip bonding, and risk of damage or cracking during assembly.
Innovation Solution
A semiconductor substrate structure comprising a conductive structure, a dielectric structure, and a metal bump, where the metal bump is physically and electrically connected to the conductive structure and has a concave surface, enhancing the bonding strength with solder bumps and reducing the risk of damage to the substrate during assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If weight reduction and miniaturization techniques are used, then weight and size are reduced, but manufacturing yield decreases and handling becomes difficult
Solution Approach 1:
The substrate structure is segmented into multiple functional layers including dielectric layers, conductive traces, and metal bumps, allowing each layer to be optimized independently for both weight reduction and manufacturing feasibility
Solution Approach 2:
The patent changes physical parameters by using specific material compositions and controlling the formation of metal bumps with convex surfaces, transforming the substrate from a thin, fragile structure to one with enhanced mechanical properties while maintaining weight reduction
2Volume of moving object
If thin semiconductor substrate structure is used, then miniaturization is achieved, but handling becomes difficult due to softness
Solution Approach 1:
Metal bumps with convex surfaces are formed on the substrate, introducing curved geometric features that enhance mechanical strength and provide stable bonding interfaces, improving handling ease while maintaining thin substrate profile
Solution Approach 2:
The substrate employs composite material structures combining dielectric layers, conductive traces, and metal bumps, creating a multi-material system that achieves both thinness and improved mechanical handling properties
3Reliability
If underfill is used in flip-chip bonding, then bonding reliability is improved, but manufacturing cost increases
Solution Approach 1:
The patent extracts and eliminates the underfill component from the bonding process by designing metal bumps with convex surfaces that provide inherent mechanical interlocking and stress distribution, achieving reliable bonding without the additional material and process steps
Solution Approach 2:
The metal bump structure with convex surface serves multiple functions simultaneously: electrical connection, mechanical bonding, and stress management, making the system self-sufficient without requiring external underfill material
4Reliability
If solder bumps are used for connection, then electrical connectivity is achieved, but cracking risk increases during assembly
Solution Approach 1:
Metal bumps with convex surfaces are formed beforehand to provide mechanical cushioning and stress distribution capability, preventing crack propagation during subsequent assembly processes while maintaining electrical connectivity
Data Source
AI summary
The present disclosure relates to a semiconductor substrate structure, semiconductor package and method of manufacturing the same. The semiconductor substrate structure includes a conductive structure, a dielectric structure and a metal bump. The conductive structure has a first conductive surface and a second conductive surface. The dielectric structure has a first dielectric surface and a second dielectric surface. The first conductive surface does not protrude from the first dielectric surface. The second conductive surface is recessed from the second dielectric surface. The metal bump is disposed in a dielectric opening of the dielectric structure, and is physically and electrically connected to the second conductive surface. The metal bump has a concave surface.