Metal Bump Bonding for Ceramic Light Source Substrates
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Solution Overview
Problem
Existing semiconductor light sources using solder balls for bonding between ceramic and mounting substrates lack sufficient bonding strength, leading to potential cracks and reduced heat release properties.
Innovation Solution
The use of metal bumps made of gold, copper, or their alloys for bonding between the ceramic and mounting substrates, along with a resin filling to enhance bonding strength and heat transfer, replaces traditional solder-based bonding methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If solder balls are used for bonding between ceramic substrate and mounting substrate, then the manufacturing process is simple and cost-effective, but the bonding strength is insufficient leading to cracks and reduced reliability
Solution Approach 1:
The patent changes the material parameter of the bonding element from solder balls to metal bumps made of gold, copper, or their alloys. This material substitution fundamentally improves bonding strength while maintaining the bump bonding process framework, thus resolving the contradiction between strength improvement and process complexity
Solution Approach 2:
The patent employs composite material structures by using metal bumps with specific compositions (gold, copper, or their alloys) that combine high strength, good electrical conductivity, and thermal conductivity. This composite approach achieves superior bonding performance without significantly complicating the manufacturing process
2Temperature
If solder balls are used for bonding, then the manufacturing cost is lower, but the heat release properties deteriorate due to insufficient bonding strength
Solution Approach 1:
The patent changes the material parameters of the bonding elements from solder to precious metal alloys (gold, copper), which possess superior thermal conductivity and bonding strength. This parameter change directly improves heat release capability while the increased material cost is offset by the enhanced product reliability and performance
3Reliability
If solder balls are used for bonding, then the process is simple, but crack occurrence increases reducing product reliability
Solution Approach 1:
The patent changes the material parameters from solder to metal bumps with higher melting points and superior mechanical properties. This substitution eliminates the cracking issue inherent in solder bonding while maintaining process simplicity through established bump bonding techniques, thus improving reliability without significantly increasing manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly increases the bonding strength between the ceramic and mounting substrates while maintaining good heat release properties, reducing thermal stress and crack occurrence, and simplifies the manufacturing process.
Implementation Method 1
maintaining good heat release properties
Data Source
AI summary
A light source includes a light emitting element configured to emit a light; a mounting substrate; and a ceramic substrate having a light emitting element mounted thereon and being bonded to the mounting substrate via a plurality of metal bumps made of gold, copper, a gold alloy, or a copper alloy. A method of manufacturing a light source includes forming a plurality of metal bumps on a mounting substrate; providing a ceramic substrate having at least one light emitting element mounted thereon; and bonding the mounting substrate and a ceramic substrate to each other via the metal bumps.