Metal Bump Insulating Layer Structure for Surface Roughness Control
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Solution Overview
Problem
The increased surface roughness of metal layers in electronic devices due to process steps affects the electrical properties, necessitating a solution to improve the design and manufacturing process.
Innovation Solution
The implementation of a first insulating layer with a first metal bump and a second insulating layer having a first opening that exposes a portion of the first metal bump, where the thickness of the first insulating layer is greater than that of the second insulating layer, providing protection and enhancing the electrical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If more process steps are used to increase I/O spacing or quantity, then the design requirements are met, but the surface roughness of the metal layer increases
Solution Approach 1:
The patent divides the insulating layer into two separate layers: a first insulating layer and a second insulating layer. This segmentation allows independent optimization of each layer's thickness and properties, enabling the metal layer to maintain smooth surface while still providing adequate insulation and spacing for increased I/O requirements
Solution Approach 2:
The patent applies different thickness values to different insulating layers (first insulating layer has different thickness than second insulating layer), allowing each layer to perform its specific function optimally. The first insulating layer provides base insulation while the second layer provides additional spacing, collectively meeting the increased I/O requirements without compromising surface quality
2Ease of manufacture
If the surface roughness of the metal layer increases, then more process steps can be accommodated, but the electrical property of the electronic device deteriorates
Solution Approach 1:
By segmenting the insulating layer into two distinct layers with different thicknesses, the patent enables multiple process steps to be performed while maintaining a smooth metal layer surface. The first insulating layer handles base insulation requirements, while the second layer provides additional protection and spacing, collectively supporting complex manufacturing processes without degrading electrical properties
Solution Approach 2:
The two-layer insulating structure acts as an intermediary between the metal layer and external environment, protecting the metal layer from damage during multiple process steps. This intermediary structure prevents surface roughness development while allowing necessary manufacturing operations to proceed, thereby preserving electrical properties
Data Source
AI summary
An electronic device and a method for manufacturing the same are provided. The electronic device includes: a first insulating layer; a first metal bump disposed on the first insulating layer; and a second insulating layer disposed on the first metal bump, wherein the second insulating layer includes a first opening exposing a portion of the first metal bump, wherein a thickness of the first insulating layer is greater than a thickness of the second insulating layer.