Metal Bump Structure for Damage-Free Electrical Testing
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Solution Overview
Problem
Current electronic component manufacturing methods face challenges in performing electrical tests without damaging the components, particularly due to the need to test each re-distribution layer, which can lead to performance issues and reduced reliability.
Innovation Solution
The solution involves creating an electronic component with a specific structure that includes an insulating layer and metal layers of varying widths, where a first metal layer is disposed on the insulating layer, and a second metal layer is disposed on the first metal layer, allowing for the use of part of the first metal layer as an auxiliary circuit for electrical testing to prevent damage during testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrical tests are performed on each re-distribution layer to facilitate subsequent manufacturing processes, then manufacturing precision and reliability are improved, but the metal bumps may be damaged during testing
Solution Approach 1:
The first metal layer is segmented into two functional regions: a first region that forms the metal bump and a second region that serves as a test circuit. This segmentation allows electrical testing to be performed on the second region without applying stress to the metal bump in the first region, thereby preventing damage while maintaining test reliability.
Solution Approach 2:
The second region of the first metal layer acts as an intermediary test circuit that enables electrical testing without directly involving the metal bump. By routing test signals through this intermediary path, the metal bump is protected from potential damage while still allowing comprehensive electrical verification of the re-distribution layer.
2Ease of manufacture
If the first metal layer has the same width as the second metal layer, then manufacturing is simplified, but electrical testing may damage the metal bump
Solution Approach 1:
The first metal layer exhibits local quality variation: in the first region it has a first width optimized for forming the metal bump, and in the second region it has a second width optimized for serving as a test circuit. This local differentiation allows each region to be optimized for its specific function while being fabricated as a single continuous layer, balancing manufacturing simplicity with testing safety.
Data Source
AI summary
An electronic component includes: an insulating layer; and a first metal bump disposed on the insulating layer and provided with: a first metal layer disposed on the insulating layer; and a second metal layer disposed on the first metal layer, wherein, in a cross-sectional view of the electronic component, the first metal layer has a first width, the second metal layer has a second width, and the first width is smaller than the second width.