Metal Smart Card Module Embedding Without Short Circuits
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Solution Overview
Problem
Existing methods for producing smart cards with a full metal surface face difficulties in milling and connecting electronic modules due to mixed materials, leading to short circuits and complex manufacturing processes.
Innovation Solution
A method involving forming a recess in a metal layer, coating it with an insulating layer, laminating a plastic layer, and milling through the recess to insert an electronic module, ensuring only plastic is milled for connections, thus preventing short circuits and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a full metal surface is used in smart cards, then the aesthetic appearance and electromagnetic shielding are improved, but the milling and connection of electronic modules becomes difficult and may lead to short circuits
Solution Approach 1:
The invention segments the manufacturing process into distinct phases: first forming the recess in the metal layer, then coating it with insulating material, and finally milling through the insulating coating and plastic layer. This segmentation allows the metal layer to maintain its full surface integrity while enabling precise module embedding without direct metal milling.
Solution Approach 2:
The recess is formed in the metal layer before the insulating coating is applied. This preliminary action allows the metal structure to be prepared in advance, and the subsequent insulating coating prevents short circuits during the final milling and connection steps, eliminating the need to mill directly into the metal.
2Manufacturing precision
If milling is performed in full metal or mixed materials, then the electronic module cavity is created, but the process becomes complex and may cause short circuits with conductive material
Solution Approach 1:
The insulating coating acts as an intermediary layer between the metal layer and the module connection points. It allows the milling process to occur in non-conductive material (the coating and plastic layer) rather than directly in metal, preventing short circuits while maintaining precise module positioning.
Solution Approach 2:
The insulating coating is applied to the recess in advance before the final milling and module insertion steps. This preliminary insulation preparation simplifies the subsequent processes by eliminating the risk of metal chip-induced short circuits and providing a clean, non-conductive surface for module embedding.
3Reliability
If direct connection of module to metal layer is made, then electrical connection is achieved, but short circuits occur due to conductive material contact
Solution Approach 1:
The insulating coating serves as a mediator that enables electrical connection while preventing unwanted conductivity. It allows the module to be connected to the antenna wires embedded in the plastic layer without direct contact with the conductive metal layer, thus preventing short circuits while maintaining reliable electrical connections.
Solution Approach 2:
The invention extracts the connection function from the metal layer by embedding antenna wires in the plastic layer that extend to contact the module. This separation allows the metal layer to maintain its shielding function while the plastic layer with embedded wires provides the electrical connection pathway, eliminating short circuit risks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simplifies milling and connection steps by using a pre-milled metal piece with an insulating coating, reducing the risk of short circuits and enhancing manufacturing efficiency.
Implementation Method 1
coating the metal layer with an insulating coating creating an insulated metal layer
Implementation Method 2
laminating a plastic layer onto the insulated metal layer
Data Source
Figure 1A~1C
Figure 2A~2C
Figure 3A~3B
AI summary
A data carrier (1) comprises a metal layer (5) with a recess (11), an electronic module (2) comprising a chip and being embedded in said recess (11), and a plastic layer (6) with embedded antenna wires (8). The electronic module (2) has a shaft portion, wherein chip contacting electric connections (7) are provided on the underside of the electronic module (2). The metal layer (5) has an insulating coating (50) at least on the surfaces of the recess (11). The plastic layer (6) comprises a recess (12) with the same circumference as or smaller than the recess (11) in the insulated metal layer (5') until a depth (15) either revealing the antenna wires (8) or not and each of the electric connections (7) is connecting one of the antenna wires (8) directly or in inductive mode, respectively.