Metal Transaction Card Resin Encapsulation
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Solution Overview
Problem
Existing metal transaction cards face issues with delamination of ferrite layers under wear and tear, temperature, and humidity, and the ferrite material is expensive. Additionally, there is a need for a metal transaction card with a metal layer where the ferrite material does not extend to the edges of the card body.
Innovation Solution
The solution involves encapsulating a metal layer in a metal card body with thermosetting resin, filling any openings or voids in the metal layer with the resin, and later implanting a chip module in a milled-out cavity within the fully cured resin. This provides mechanical support and electrical insulation to the chip module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If ferrite material is used to shield the antenna from the metal layer, then electromagnetic shielding is improved, but the ferrite layer delaminates under wear and tear and temperature/humidity conditions
Solution Approach 1:
The patent removes the ferrite layer entirely from the card structure. Instead of using ferrite for electromagnetic shielding, the invention uses a discontinuous metal layer with strategic openings that allow RF fields to pass through while still providing shielding where needed. This extraction of the problematic ferrite layer eliminates the delamination issue while maintaining the shielding function through an alternative metal-based approach.
Solution Approach 2:
The patent creates a composite structure combining a continuous metal layer with a discontinuous metal layer having strategic openings. This composite metal structure replaces the ferrite layer and provides electromagnetic shielding through the interaction of the two metal layers, where the discontinuous layer with openings allows RF fields to penetrate while the continuous layer provides overall shielding.
2Object-affected harmful factors
If ferrite material is used for electromagnetic shielding, then antenna performance is protected, but the cost increases due to expensive ferrite material
Solution Approach 1:
The patent replaces expensive ferrite material with a discontinuous metal layer that can be manufactured from standard metal sheets. The metal layer with strategic openings provides the same shielding function at a lower cost, using readily available metal materials instead of costly ferrite compounds.
Solution Approach 2:
The discontinuous metal layer is designed with strategic openings at specific locations where RF fields need to pass through, while maintaining metal coverage in other areas for shielding. This localized approach provides effective shielding only where needed, reducing the total amount of expensive material required.
3Object-affected harmful factors
If ferrite layer is applied to the metal card, then electromagnetic interference is reduced, but the ferrite material extends to the edges causing delamination
Solution Approach 1:
The patent segments the metal layer into a continuous base layer and a discontinuous overlay layer with strategic openings. This segmentation allows the discontinuous layer to be positioned only where needed for RF field management, rather than extending continuously to the edges where it would cause delamination issues.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of thermosetting resin effectively addresses the delamination issues and reduces the need for expensive ferrite materials. It provides a durable and cost-effective solution for metal transaction cards with improved mechanical support and electrical insulation for the chip module.
Implementation Method 1
The hardened resin provides mechanical support to the chip module and electrical insulation from the metal layer
Implementation Method 2
The hardened resin provides mechanical support to the chip module and electrical insulation from the metal layer
Data Source
AI summary
Metal layers (650, 730, 750, 830, 850) of a smartcard (SC, 600, 700, 800) have module openings (614, 712, 714, 812, 814) for receiving a transponder chip module (TCM). Thermosetting resin (TR, 668B, 768A, 768B, 868A, 868B) coats (encapsulates) the bottom surfaces and fills the module openings of the metal layers. A first metal layer (650, 750, 850) may have a slit (S; 620, 720B, 820) which may also be filled by the thermosetting resin. A second metal layer (ML, 730) disposed above the first metal layer (750) may have a slit (S, 720A) which may also be filled by the thermosetting resin. A booster antenna circuit (BAC, 844) may be disposed between the first and second metal layers, with magnetic shielding material (842) disposed between the booster antenna circuit and the second metal layer (730).