Metal Case Thermal Insulation via Segmented Channels

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Solution Overview

Problem

Metal case assemblies in electronic devices conduct heat quickly, leading to high-temperature hot spots and overheating among components, causing user discomfort and performance deterioration due to inadequate heat dissipation.

Innovation Solution

A case assembly with a metal case and a plastic cladding body, featuring a channel that divides the inner side into thermal insulation areas, along with a thermal barrier portion and a fan to manage heat dissipation, preventing heat concentration and transmission between components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a metal case is used to provide structural strength and rigidity, then the structural strength and rigidity are improved, but heat from heat sources is quickly conducted to the case surface forming high-temperature hot spots that cause user discomfort

Engineering Contradiction:
Improvestructural strengthVSAvoidhot spot temperature
Core Design Contradiction:
StrengthVSTemperature

Solution Approach 1:

The inner side of the metal case is divided into multiple thermal insulation areas by concave channels. This segmentation prevents heat from spreading across the entire case surface, isolating heat sources from the outer surface and reducing hot spot formation while maintaining the overall structural integrity of the metal case.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A plastic cladding body is introduced as an intermediary layer between the metal case and the external environment. This plastic layer has lower thermal conductivity than metal, acting as a thermal barrier that reduces heat transmission to the case surface while preserving the metal case's structural strength.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Loss of energy

If a metal case is used for heat dissipation, then heat is conducted quickly to the outside, but heat from one heat source is easily transmitted to other heat sources or electronic elements causing overheat and performance deterioration

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidcomponent temperature
Core Design Contradiction:
Loss of energyVSTemperature

Solution Approach 1:

The metal case inner side is segmented into multiple thermal insulation areas by concave channels, creating isolated thermal zones. Each heat source is contained within its own thermal zone, preventing heat transmission between adjacent heat sources and electronic elements while still allowing heat dissipation to the external environment through the metal case structure.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces the formation of high-temperature hot spots and prevents overheating by diffusing heat gradually and isolating components, enhancing user comfort and device performance through improved heat dissipation management.

Implementation Method 1

a channel which is concavely disposed on the inner side to divide the inner side into a plurality of thermal insulation areas

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 2

The plastic cladding body is disposed on the metal case, and completely covers the outer side of the metal case

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 3

The case assembly further comprises a fan, wherein the thermal barrier portion comprises a groove, and the fan is disposed in the groove

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS11330734B2Case assembly and electronic device
Publication Date: 2022.05.10 HTC CORP
  • US11330734B2 patent drawing
  • US11330734B2 patent drawing
  • US11330734B2 patent drawing

AI summary

A case assembly and an electronic device are provided. The case assembly includes a metal case and a plastic cladding body. The metal case includes an inner side and an outer side, the inner side is opposite to the outer side. The metal case further includes a channel which is concavely disposed on the inner side to divide the inner side into a plurality of thermal insulation areas. The plastic cladding body is disposed on the metal case, and completely covers the outer side of the metal case. The electronic device includes a case assembly and a plurality of heart sources. The heart sources are corresponded to the thermal insulation areas on the inner side of the metal case respectively. Thus, the case assembly and the electronic device are able to prevent the heat produced from elements effect each other.