Metal Casing Conductive Projections for Grounding Stability

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Solution Overview

Problem

Electronic devices with metal casings face challenges in reducing unwanted radiation due to the lack of effective electrical connections and grounding, which affects the stability of electronic components and overall device performance.

Innovation Solution

The implementation of a casing design featuring a metal outer layer member, a metal inner layer member, and conductive projections that extend between them to establish an electrical connection, thereby reducing unwanted radiation by providing a stable ground potential and enhancing the sealing function of the adhesive layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a metal casing is used without effective electrical connection between layers, then the device structure is simple and lightweight, but unwanted radiation increases and grounding stability deteriorates

Engineering Contradiction:
Improveunwanted radiationVSAvoidcasing structure complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

A conductive projection is introduced as an intermediary element between the outer layer member and inner layer member to establish electrical connection. This projection extends from one layer to the other and makes contact with both, serving as a mediator that enables grounding and radiation shielding without requiring complex multi-component assemblies. The adhesive layer also serves as an intermediary that bonds the layers while allowing the conductive projection to penetrate through it.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If conductive projections are added to connect inner and outer layer members, then grounding stability improves and radiation is reduced, but manufacturing complexity increases

Engineering Contradiction:
Improvegrounding stabilityVSAvoidcasing manufacturing ease
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The conductive projection is merged with either the outer layer member or inner layer member during the molding process, rather than being a separate component. This integration ensures that the conductive element is formed as part of the casing structure, reducing assembly steps and manufacturing complexity while maintaining reliable electrical connection between layers.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If adhesive layer is used to bond metal layers, then sealing function is enhanced, but electrical connection may be compromised without conductive projections

Engineering Contradiction:
Improvesealing functionVSAvoidelectrical isolation
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The bonding interface is segmented into functional zones: the adhesive layer provides sealing and mechanical bonding in certain areas, while the conductive projection provides electrical connection in specific locations. This segmentation allows each element to perform its specialized function without interfering with the other, as the conductive projection creates discrete electrical contact points that penetrate through the adhesive layer.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces unwanted radiation, enhances the strength and reliability of the casing, and maintains a lightweight and aesthetically pleasing design by using aluminum for the outer layer and magnesium for the inner layer, while ensuring proper grounding without compromising the outer appearance.

Implementation Method 1

a conductive projection is formed between the inner layer member and the outer layer member, and is configured to extend like a line on a surface of one of the inner layer member and the outer layer member and have a top end that contacts with the other of the inner layer member and the outer layer member, to electrically connect between the inner layer member and the outer layer member

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS9215821B2Electronic device
Publication Date: 2015.12.15 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
  • US9215821B2 patent drawing
  • US9215821B2 patent drawing
  • US9215821B2 patent drawing

AI summary

An electronic device 100 includes a casing 101 configured to accommodate electronic components. The casing 101 includes an outer layer member 131 formed by a metal and exposed to an outside, and an inner layer member 132 formed by a metal and spaced from an inner surface of the outer layer member 131. Conductive projections 140a and 140b are each formed between the inner layer member 132 and the outer layer member 131, and are each configured to extend like a line on a surface of one of the inner layer member 132 and the outer layer member 131 and have a top end that contacts with the other of the inner layer member 132 and the outer layer member 131, to electrically connect between the inner layer member 132 and the outer layer member 131.